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DSPIC33EP512MC806-E/MR

Microchip Technology

DSPIC33EP512MC806-E/MR by Microchip Technology

DSPIC33EP512MC806-E/MR by Microchip operates at 3.6V max supply voltage, with 60MHz clock frequency and 53248 RAM words. Ideal for automotive applications, it features a CMOS technology, FLASH ROM programmability, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$11.050

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 16 parts In-Stock

1+ parts

$10.468

100+ parts

$10.055

1k+ parts

$9.433

10k+ parts

$9.433

16

$10.468

$10.055

$9.433

$9.433

Microchip Technology

USA . 508 parts In-Stock

1+ parts

$11.200

100+ parts

$9.290

1k+ parts

$8.550

10k+ parts

$8.130

508

$11.200

$9.290

$8.550

$8.130

Master Electronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$10.900

1k+ parts

-

10k+ parts

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100

-

$10.900

-

-

Verical

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$13.310

1k+ parts

-

10k+ parts

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100

-

$13.310

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$10.684

100+ parts

-

1k+ parts

-

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50

$10.684

-

-

-

NAC Semi

USA . 400 parts In-Stock

1+ parts

$11.600

100+ parts

$10.520

1k+ parts

$9.620

10k+ parts

-

400

$11.600

$10.520

$9.620

-

Vyrian

USA . 8,858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,858

-

-

-

-

IBS Electronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$15.287

1k+ parts

-

10k+ parts

-

100

-

$15.287

-

-

Elcom Components

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 28 parts In-Stock

1+ parts

$8.300

100+ parts

-

1k+ parts

-

10k+ parts

-

28

$8.300

-

-

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Semicontronic

India . 28 parts In-Stock

1+ parts

$8.300

100+ parts

$8.092

1k+ parts

$8.051

10k+ parts

-

28

$8.300

$8.092

$8.051

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AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$10.391

100+ parts

-

1k+ parts

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10k+ parts

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847

$10.391

-

-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$10.470

100+ parts

-

1k+ parts

$10.052

10k+ parts

-

500

$10.470

-

$10.052

-

Continental Prestige Electronics

USA . 6,308 parts In-Stock

1+ parts

$10.684

100+ parts

-

1k+ parts

-

10k+ parts

$10.470

6,308

$10.684

-

-

$10.470

Aztec Data Supply Inc.

USA . 3,128 parts In-Stock

1+ parts

$55.270

100+ parts

-

1k+ parts

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10k+ parts

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3,128

$55.270

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$65.140

100+ parts

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71

$65.140

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Fulton Briggs Corp.

USA . 7,708 parts In-Stock

1+ parts

-

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7,708

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-

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Argo Parts USA

USA . 4,177 parts In-Stock

1+ parts

-

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4,177

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Overview

Unleash the power of advanced signal processing with the DSPIC33EP512MC806-E/MR by Microchip Technology! This cutting-edge digital signal processor offers unrivaled precision and performance in a compact package. Ideal for automotive applications, this chip delivers high-speed processing, low power consumption, and versatile functionality. Revolutionize your projects with Microchip's top-of-the-line technology and experience the difference in quality and efficiency. Upgrade to the DSPIC33EP512MC806-E/MR today and take your designs to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this DSP lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable, this DSP is easy to install and saves space on PCB, making it suitable for compact designs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle various input power levels, increasing its versatility.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 allows for fast and efficient data processing, enhancing the performance of the DSP.

Package Shape: SQUARE

The square package shape enables efficient heat dissipation and easy integration into square or compact layouts.

Bit Size: 16

The 16-bit size allows for high precision and accuracy in signal processing tasks, making this DSP suitable for demanding applications.

No. of Terminals: 64

With 64 terminals, this DSP offers multiple connection points for peripherals, enabling versatile system configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide flexibility in mounting options, catering to different application requirements.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this DSP to withstand harsh environmental conditions, improving its reliability in industrial settings.

No. of External Interrupts: 5

With 5 external interrupts, this DSP can efficiently handle external events, enhancing its responsiveness in real-time applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good electrical conductivity and solderability, ensuring reliable connections for long-term use.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512MC806-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP512MC806-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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