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TNETV2501INPGF

Texas Instruments

TNETV2501INPGF by Texas Instruments

TNETV2501INPGF by Texas Instruments is a 32-bit DSP with 20-bit address bus width, operating b/w -40 to 85°C. It features low power mode, boundary scan, and CMOS technology. Ideal for industrial applications requiring high-performance digital signal processing in a compact flatpack package.

Median Price

$7.366

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$7.366

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-

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26

$7.366

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Vyrian

USA . 2,405 parts In-Stock

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2,405

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Digiode

USA . 1,635 parts In-Stock

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1,635

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 169 parts In-Stock

1+ parts

$7.366

100+ parts

-

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169

$7.366

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Continental Prestige Electronics

USA . 1,193 parts In-Stock

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$7.366

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$7.219

1,193

$7.366

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$7.219

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.366

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$6.998

10k+ parts

$6.851

50

$7.366

-

$6.998

$6.851

Advanced Electronics

New Zealand . 74 parts In-Stock

1+ parts

$7.513

100+ parts

$7.513

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$7.513

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74

$7.513

$7.513

$7.513

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Ampacity Inc.

Singapore . 1,014 parts In-Stock

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$11.000

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1,014

$11.000

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Semicontronic

India . 1,379 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

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1,379

$15.000

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One Stop Electronics

USA . 941 parts In-Stock

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$17.000

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941

$17.000

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AZTECH Wire

Italy . 867 parts In-Stock

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$18.617

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867

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Microchip USA

USA . 2,742 parts In-Stock

1+ parts

$31.810

100+ parts

$31.350

1k+ parts

$31.130

10k+ parts

$30.900

2,742

$31.810

$31.350

$31.130

$30.900

Parana Technologies

USA . 1,934 parts In-Stock

1+ parts

$46.386

100+ parts

$4,307.635

1k+ parts

$41.747

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1,934

$46.386

$4,307.635

$41.747

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DigiPath Technology Company

USA . 1,229 parts In-Stock

1+ parts

$51.077

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$51.077

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ChromeModa Solutions

Germany . 3,638 parts In-Stock

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$52.119

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$42.738

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3,638

$52.119

$42.738

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IDEA Electronic Components Group

UK . 1,180 parts In-Stock

1+ parts

$52.119

100+ parts

$49.513

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$46.907

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1,180

$52.119

$49.513

$46.907

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QUARKTWIN TECHNOLOGY LTD

USA . 12,445 parts In-Stock

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Corphita

USA . 3,947 parts In-Stock

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3,947

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Argo Parts USA

USA . 1,864 parts In-Stock

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1,864

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Overview

Experience the power of Texas Instruments with the TNETV2501INPGF Digital Signal Processor. This high-quality DSP offers unmatched performance and reliability, making it the ideal choice for a wide range of applications. From audio processing to telecommunications, this versatile chip delivers exceptional value and benefits to customers. Trust in Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.32 V

Allows for reliable and stable operation within specified voltage range.

Address Bus Width: 20

Enables efficient addressing of memory locations for data processing.

Package Shape: SQUARE

Facilitates space-saving design and integration into compact electronic devices.

No. of Terminals: 176

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK

Ensures easy handling and installation during manufacturing processes.

Minimum Supply Voltage: 1.2 V

Allows for flexibility in power input while maintaining operational integrity.

Maximum Operating Temperature: 85 °C

Ensures reliable performance under varying temperature conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: QUAD

Allows for efficient routing of connections for optimal signal processing.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during manufacturing and maintenance.

External Data Bus Width: 32

Enables faster data transfer rates and processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering of the DSP during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes without damage.

Internal Bus Architecture: MULTIPLE

Enhances data flow efficiency and overall performance of the DSP.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with demanding temperature requirements.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile for various digital signal processing applications outside of standard functions.

Technology: CMOS

Employs low power consumption and high noise immunity characteristics for efficient operation.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connection to the circuit board.

Nominal Supply Voltage: 1.26 V

Optimal voltage level for stable and efficient performance of the DSP.

Format: FIXED POINT

Specific data representation format for precise mathematical computations and signal processing tasks.

Moisture Sensitivity Level (MSL): 4

Indicates resistance to moisture and environmental conditions for prolonged operational life.

Low Power Mode: YES

Allows for energy-efficient operation and extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2501INPGF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TNETV2501INPGF Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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