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TNETV2507ANPGE

Texas Instruments

TNETV2507ANPGE by Texas Instruments

TNETV2507ANPGE by Texas Instruments is a DSP with 16-bit external data bus, 14-bit address bus, and CMOS technology. It operates in industrial temperature range (-40 to 85°C) and supports low power mode. Ideal for applications requiring high-performance digital signal processing in compact form factors.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,653 parts In-Stock

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Digiode

USA . 4,398 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 347 parts In-Stock

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$8.000

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347

$8.000

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AZTECH Wire

Italy . 861 parts In-Stock

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$8.436

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861

$8.436

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Ampacity Inc.

Singapore . 616 parts In-Stock

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$11.000

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$11.000

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Parana Technologies

USA . 947 parts In-Stock

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$20.563

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$20.655

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947

$20.563

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$20.655

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DigiPath Technology Company

USA . 2,022 parts In-Stock

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$22.643

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$20.831

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$22.643

$20.831

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ChromeModa Solutions

Germany . 5,340 parts In-Stock

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$23.105

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$18.946

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$23.105

$18.946

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IDEA Electronic Components Group

UK . 590 parts In-Stock

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$23.105

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$21.950

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$20.794

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590

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$20.794

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Corohmni

South Africa . 2,118 parts In-Stock

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$73.457

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QUARKTWIN TECHNOLOGY LTD

USA . 7,613 parts In-Stock

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Corphita

USA . 2,679 parts In-Stock

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Overview

Experience the unmatched quality and performance of the TNETV2507ANPGE by Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) offers a wide range of applications, providing customers with exceptional value and benefits. With advanced technology and innovative features, this product delivers superior results, making it the perfect choice for all your digital processing needs. Trust Texas Instruments to bring you reliable products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy and compact installation of the DSP.

Maximum Supply Voltage: 1.65 V

Allows for efficient power management while providing enough voltage for optimal performance.

Address Bus Width: 14

A wider address bus allows for more memory addressing capabilities and faster data processing.

Package Shape: SQUARE

Square package shape helps in easy handling and placement of the product on circuit boards.

No. of Terminals: 144

Higher number of terminals allow for more connectivity options and interfaces with other components.

Minimum Supply Voltage: 1.55 V

Low minimum supply voltage enables energy-efficient operation of the DSP.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finishing provides good conductivity and corrosion resistance for the terminals.

Terminal Position: QUAD

Quad terminal position allows for efficient and secure connection with the circuit board.

Width: 20 mm

Compact width makes the DSP suitable for applications where space is limited.

External Data Bus Width: 16

Wider external data bus width allows for faster data transfer and processing.

Peak Reflow Temperature: 260

High peak reflow temperature ensures proper soldering and reliability during assembly.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the DSP can operate in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for integration with various digital signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for efficient processing.

Nominal Supply Voltage: 1.6 V

Optimal nominal supply voltage for balanced performance and power efficiency.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for compact design and efficient PCB layout.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2507ANPGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TNETV2507ANPGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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