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TNETV2665VIDZWT7

Texas Instruments

TNETV2665VIDZWT7 by Texas Instruments

TNETV2665VIDZWT7 by Texas Instruments is a DSP with 32-bit external data bus, 30 MHz clock frequency, and 13-bit address bus width. It is ideal for applications requiring low power consumption and fixed-point format processing in digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,677 parts In-Stock

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Digiode

USA . 562 parts In-Stock

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AZTECH Wire

Italy . 480 parts In-Stock

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$9.821

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$9.821

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One Stop Electronics

USA . 1,507 parts In-Stock

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$19.000

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Advanced Electronics

New Zealand . 65 parts In-Stock

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$23.330

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$23.096

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$22.163

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Corohmni

South Africa . 753 parts In-Stock

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Parana Technologies

USA . 1,257 parts In-Stock

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$47.242

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DigiPath Technology Company

USA . 2,374 parts In-Stock

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$52.019

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$47.858

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ChromeModa Solutions

Germany . 2,081 parts In-Stock

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$53.081

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$43.526

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IDEA Electronic Components Group

UK . 892 parts In-Stock

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$50.427

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Corphita

USA . 3,588 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the TNETV2665VIDZWT7, a high-quality Digital Signal Processor designed to enhance your audio and video applications. With its advanced features and reliable performance, this product offers unparalleled value and benefits to customers seeking top-notch processing capabilities. Trust in the expertise of Texas Instruments and elevate your projects to the next level with the TNETV2665VIDZWT7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it a good choice for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the DSP, reducing manufacturing costs and enabling compact designs.

Maximum Supply Voltage: 1.26 V

With a relatively low maximum supply voltage, this DSP is energy-efficient and can help prolong battery life in battery-powered devices.

Address Bus Width: 13

A wider address bus allows for larger memory addressing capabilities and faster data processing, making this DSP suitable for demanding applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, enabling compact designs and saving valuable real estate in electronic devices.

No. of Terminals: 361

Having a high number of terminals enables versatile connectivity options and allows for interfacing with multiple external components, making this DSP versatile in various applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures that the DSP can operate efficiently even under low power conditions, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this DSP can withstand elevated temperatures without compromising performance, making it suitable for harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold environments, making this DSP suitable for a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for convenient and secure soldering to the PCB, ensuring reliable connections and ease of assembly.

Maximum Seated Height: 1.4 mm

The low seated height enables a compact overall design, making this DSP suitable for slim and space-constrained electronic devices.

Width: 16 mm

The moderate width allows for efficient layout on circuit boards and compatibility with standard board sizes, making integration into existing designs straightforward.

Boundary Scan: YES

The presence of boundary scan capability allows for efficient testing and debugging of the DSP during manufacturing and in the field, ensuring high product quality.

External Data Bus Width: 32

A wide external data bus width enables high-speed data transfer and processing, making this DSP suitable for demanding computational tasks.

Maximum Clock Frequency: 30 MHz

With a high maximum clock frequency, this DSP can perform rapid data processing and real-time computations, making it ideal for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time allows for reliable soldering during manufacturing, ensuring secure connections and long-term performance of the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables robust soldering and thermal bonding, ensuring the durability and reliability of the DSP in various operating conditions.

Internal Bus Architecture: MULTIPLE

Having a multiple internal bus architecture enhances data throughput and processing efficiency, making this DSP suitable for complex computational tasks.

Length: 16 mm

The moderate length allows for efficient placement on circuit boards and compatibility with standard board dimensions, facilitating integration into various electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

With versatile peripheral IC types, this DSP can interface with a wide range of external devices and sensors, making it suitable for diverse applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this DSP energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Having ball terminals enables secure and reliable connections during soldering, ensuring long-term performance and durability of the DSP in various operating conditions.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating voltage for the DSP, ensuring consistent performance and reliability in a wide range of applications.

Terminal Pitch: 0.8 mm

The tight terminal pitch allows for efficient layout on circuit boards and compact designs, making this DSP suitable for space-constrained electronic devices.

Format: FIXED POINT

Utilizing fixed-point arithmetic simplifies computational complexity and enhances processing speed, making this DSP ideal for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that this DSP is moderately sensitive to moisture during handling and storage, requiring standard precautions to prevent moisture-related damage.

Low Power Mode: YES

The presence of a low-power mode allows for energy-efficient operation and extended battery life, making this DSP suitable for battery-powered or portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2665VIDZWT7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2665VIDZWT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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