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TNETV2665FIBZWTA6

Texas Instruments

TNETV2665FIBZWTA6 by Texas Instruments

TNETV2665FIBZWTA6 by Texas Instruments is a DSP with 32-bit external data bus width, 30 MHz max clock frequency, and 1.2 V nominal voltage. Ideal for applications requiring low power mode, such as telecommunications equipment and audio processing systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,705 parts In-Stock

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7,705

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Digiode

USA . 415 parts In-Stock

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415

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 226 parts In-Stock

1+ parts

$1.000

100+ parts

-

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226

$1.000

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AZTECH Wire

Italy . 189 parts In-Stock

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$13.210

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189

$13.210

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Ampacity Inc.

Singapore . 1,379 parts In-Stock

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$24.000

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1,379

$24.000

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Parana Technologies

USA . 1,894 parts In-Stock

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$40.285

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1,894

$40.285

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Corohmni

South Africa . 180 parts In-Stock

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$43.218

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180

$43.218

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DigiPath Technology Company

USA . 1,544 parts In-Stock

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$44.359

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1,544

$44.359

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ChromeModa Solutions

Germany . 6,895 parts In-Stock

1+ parts

$45.264

100+ parts

$37.116

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6,895

$45.264

$37.116

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IDEA Electronic Components Group

UK . 1,493 parts In-Stock

1+ parts

$45.264

100+ parts

$43.001

1k+ parts

$40.738

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1,493

$45.264

$43.001

$40.738

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Microchip USA

USA . 2,957 parts In-Stock

1+ parts

$98.900

100+ parts

$97.180

1k+ parts

$96.320

10k+ parts

$95.460

2,957

$98.900

$97.180

$96.320

$95.460

Corphita

USA . 4,584 parts In-Stock

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4,584

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Overview

Experience unparalleled performance and reliability with the TNETV2665FIBZWTA6 by Texas Instruments. As a leading manufacturer of digital signal processors, Texas Instruments delivers cutting-edge technology that is versatile and efficient. Whether you're in the telecommunications industry or working on audio processing applications, this DSP offers superior value and benefits. With a maximum supply voltage of 1.26V and a clock frequency of 30MHz, this product is designed to meet your needs while ensuring top-notch quality and functionality. Upgrade your systems today with Texas Instruments' TNETV2665FIBZWTA6 and elevate your performance to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the DSP, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and convenient installation on printed circuit boards.

Maximum Supply Voltage: 1.26 V

Offers a high supply voltage to support the processing needs of the DSP.

Address Bus Width: 13

Provides a wide address bus width for efficient data processing and memory access.

Package Shape: SQUARE

Square package shape allows for compact and space-saving installation.

No. of Terminals: 361

Large number of terminals facilitate connectivity and integration with other components.

Maximum Operating Temperature: 90 °C

The high operating temperature range ensures reliable performance in various conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2665FIBZWTA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2665FIBZWTA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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