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TNETV2664FIDZWT

Texas Instruments

TNETV2664FIDZWT by Texas Instruments

TNETV2664FIDZWT by Texas Instruments is a DSP with 32-bit external data bus, 30 MHz clock frequency, and 1.2 V nominal voltage. Ideal for low power applications in digital signal processing due to its CMOS technology and boundary scan feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,012 parts In-Stock

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6,012

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Digiode

USA . 3,300 parts In-Stock

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3,300

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Distributors (Availability)

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One Stop Electronics

USA . 1,171 parts In-Stock

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$12.000

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1,171

$12.000

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AZTECH Wire

Italy . 725 parts In-Stock

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$17.481

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725

$17.481

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$25.317

100+ parts

$23.038

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$20.760

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900

$25.317

$23.038

$20.760

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Parana Technologies

USA . 1,479 parts In-Stock

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$31.313

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$77.118

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1,479

$31.313

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$77.118

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DigiPath Technology Company

USA . 306 parts In-Stock

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$34.479

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$31.721

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306

$34.479

$31.721

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ChromeModa Solutions

Germany . 6,082 parts In-Stock

1+ parts

$35.183

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$28.850

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6,082

$35.183

$28.850

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IDEA Electronic Components Group

UK . 189 parts In-Stock

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$35.183

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$33.424

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$31.665

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189

$35.183

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$31.665

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Corohmni

South Africa . 44 parts In-Stock

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$71.615

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Corphita

USA . 197 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TNETV2664FIDZWT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that are versatile and reliable. The TNETV2664FIDZWT offers customers unparalleled value and benefits, making it ideal for a wide range of applications. From high-performance audio systems to advanced communication devices, this product provides the performance and efficiency that customers need. Upgrade your technology with Texas Instruments and discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing overall manufacturing cost.

Maximum Supply Voltage: 1.26 V

Efficient power consumption with a low maximum supply voltage helps in reducing heat dissipation and improving overall system reliability.

Address Bus Width: 13

A wide address bus width allows for efficient data processing and handling of complex algorithms.

Package Shape: SQUARE

Square package shape helps in better utilization of PCB space and easier integration into designs.

No. of Terminals: 361

Having a high number of terminals allows for versatile connectivity options and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides high-density mounting capabilities and improves overall signal integrity.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 90 °C

High maximum operating temperature allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

Wide operating temperature range ensures stable operation in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish with Tin Silver Copper provides good conductivity, corrosion resistance, and solderability for reliable connections.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically as a digital signal processor with additional capabilities for versatile signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, enhancing overall performance efficiency.

Format: FIXED POINT

Fixed-point format allows for efficient arithmetic operations and precise calculations in signal processing applications.

Low Power Mode: YES

Low power mode feature helps in further reducing power consumption during idle or low processing load scenarios, ideal for energy-efficient designs.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2664FIDZWT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2664FIDZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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