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TNETV2665FIBZWT7

Texas Instruments

TNETV2665FIBZWT7 by Texas Instruments

TNETV2665FIBZWT7 by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at max 30 MHz. Ideal for digital signal processing applications due to low power mode, CMOS technology, and fixed-point format. Package style is grid array with 361 terminals in a square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,522 parts In-Stock

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Digiode

USA . 1,438 parts In-Stock

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1,438

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Distributors (Availability)

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AZTECH Wire

Italy . 367 parts In-Stock

1+ parts

$17.127

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367

$17.127

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Ampacity Inc.

Singapore . 203 parts In-Stock

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$24.000

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One Stop Electronics

USA . 799 parts In-Stock

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$30.000

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799

$30.000

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Parana Technologies

USA . 631 parts In-Stock

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$45.743

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$45.743

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DigiPath Technology Company

USA . 256 parts In-Stock

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$50.369

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$46.340

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256

$50.369

$46.340

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ChromeModa Solutions

Germany . 1,809 parts In-Stock

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$51.397

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$42.146

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$42.146

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IDEA Electronic Components Group

UK . 983 parts In-Stock

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$51.397

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$48.827

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$46.257

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983

$51.397

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Corohmni

South Africa . 791 parts In-Stock

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$51.616

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Component Stockers USA

USA . 40 parts In-Stock

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$820.450

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40

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QUARKTWIN TECHNOLOGY LTD

USA . 9,838 parts In-Stock

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Corphita

USA . 4,047 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TNETV2665FIBZWT7 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that are perfect for a wide range of applications. With a focus on value and performance, this product offers customers unmatched benefits and advantages. Whether you're looking to enhance your audio processing capabilities or streamline your digital communications, the TNETV2665FIBZWT7 is the perfect solution for all your needs. Trust in Texas Instruments for superior quality and reliability in every product they offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

The higher maximum supply voltage allows for flexibility in power input, accommodating different system requirements.

Address Bus Width: 13

The wide address bus width facilitates faster data processing and communication within the DSP, enhancing overall performance.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making the DSP suitable for various electronic devices with limited space.

No. of Terminals: 361

The high number of terminals enables versatile connectivity options and compatibility with different interfaces and systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a low profile and fine pitch design, enhancing the DSP's integration and performance within compact devices.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures energy efficiency and optimal power usage, reducing the overall operational costs.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the DSP to function reliably in various environmental conditions, increasing its versatility and usability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures consistent performance even in colder environments, making the DSP suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-lasting performance.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure placement on the circuit board, enhancing the overall stability of the DSP within the system.

Maximum Seated Height: 1.4 mm

The low maximum seated height makes the DSP suitable for slim and compact devices, enabling its integration in space-constrained applications.

Width: 16 mm

The moderate width offers a balance between compactness and functionality, making the DSP versatile and suitable for a wide range of electronic devices.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during production, ensuring high quality and reliability.

External Data Bus Width: 32

The wide external data bus width enables fast data transfer and processing, enhancing the overall speed and efficiency of the DSP.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency ensures quick and responsive operation of the DSP, making it suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature indicates efficient manufacturing process, leading to reliable and consistent performance of the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature withstands the soldering process during assembly, ensuring secure and durable connections for the DSP.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture facilitates parallel processing and data transfer, enhancing the overall performance and efficiency of the DSP.

Length: 16 mm

The moderate length offers a balance between compactness and functionality, making the DSP versatile and suitable for various electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types enhances the connectivity and functionality of the DSP, making it adaptable to different applications and systems.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the DSP energy-efficient and suitable for battery-operated devices.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, enabling stable operation and performance of the DSP within the system.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a standard reference for power input, ensuring compatibility and stability in various operating conditions.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for compact layout and efficient connection within the circuit board, optimizing the overall performance of the DSP.

Format: FIXED POINT

The fixed-point format simplifies data processing and computation, enhancing the efficiency and accuracy of the DSP in numerical calculations.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring standard handling and storage procedures to maintain the quality and reliability of the DSP.

Low Power Mode: YES

The low power mode allows for energy-saving operation and extended battery life, making the DSP suitable for portable and power-efficient devices.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2665FIBZWT7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2665FIBZWT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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