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TNETV1644ZDU6

Texas Instruments

TNETV1644ZDU6 by Texas Instruments

TNETV1644ZDU6 by Texas Instruments is a 376-terminal DSP with 32-bit external data bus, operating at max 27 MHz. Ideal for digital signal processing applications, it features low power mode, CMOS technology, and boundary scan capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,638 parts In-Stock

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3,638

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Digiode

USA . 3,547 parts In-Stock

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3,547

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Distributors (Availability)

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One Stop Electronics

USA . 1,087 parts In-Stock

1+ parts

$7.000

100+ parts

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1,087

$7.000

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AZTECH Wire

Italy . 303 parts In-Stock

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$9.834

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303

$9.834

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Ampacity Inc.

Singapore . 1,486 parts In-Stock

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$21.000

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$21.000

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Parana Technologies

USA . 500 parts In-Stock

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$40.367

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500

$40.367

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ChromeModa Solutions

Germany . 2,316 parts In-Stock

1+ parts

$45.356

100+ parts

$37.192

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2,316

$45.356

$37.192

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IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$45.356

100+ parts

$43.088

1k+ parts

$40.820

10k+ parts

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1,890

$45.356

$43.088

$40.820

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Corohmni

South Africa . 3 parts In-Stock

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$86.733

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3

$86.733

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Component Stockers USA

USA . 195 parts In-Stock

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$627.020

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195

$627.020

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Corphita

USA . 4,314 parts In-Stock

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4,314

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DigiPath Technology Company

USA . 665 parts In-Stock

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$40.893

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665

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$40.893

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Overview

Experience the unparalleled quality and performance of the TNETV1644ZDU6 by Texas Instruments, a leading manufacturer in the industry. This digital signal processor (DSP) provides cutting-edge technology for a wide range of applications, offering customers superior value and benefits. With a focus on innovation and reliability, this product delivers exceptional results while exceeding expectations. Upgrade your systems with the TNETV1644ZDU6 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easier assembly and compact design, saving space on the PCB.

Maximum Supply Voltage: 1.26 V

Operates efficiently with a relatively low maximum supply voltage, reducing power consumption.

Address Bus Width: 13

The wide address bus enables the processor to access a large memory space, improving performance.

Package Shape: SQUARE

Square shape simplifies PCB layout and component placement, optimizing space utilization.

No. of Terminals: 376

High number of terminals accommodate complex connections, making it versatile for different applications.

Package Style (Meter): GRID ARRAY

Grid array package style enhances solder joint reliability and mechanical stability.

Minimum Supply Voltage: 1.14 V

Allows for operation at low voltages, which can extend battery life in portable devices.

Maximum Operating Temperature: 90 °C

Withstands high temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of operating in cold conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

Triple finish provides good solderability, corrosion resistance, and electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and allows for better heat dissipation.

Maximum Seated Height: 2.48 mm

Low profile design saves space in the system and allows for compact product designs.

Width: 23 mm

Standard width facilitates compatibility with common PCB sizes and form factors.

Boundary Scan: YES

Boundary scan feature allows for easy testing and debugging of interconnected components.

External Data Bus Width: 32

Wide data bus width enables fast data transfer and processing, improving overall system performance.

Maximum Clock Frequency: 27 MHz

High clock frequency allows for speedy data processing and execution of complex algorithms.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high peak reflow temperatures during soldering without damage.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and parallel processing capabilities.

Length: 23 mm

Compact length allows for space-efficient placement on the PCB and in electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral IC type for DSP enhances processing power and functionality for specific applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form ensures reliable connections and efficient heat dissipation during operation.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and reliability in operation.

Terminal Pitch: 1 mm

Fine terminal pitch allows for dense packing of components on the PCB, maximizing space utilization.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves processing speed for integer calculations.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level indicates the product's resistance to moisture-related damage during handling and storage.

Low Power Mode: YES

Low power mode feature enables energy-efficient operation, extending battery life in mobile and IoT devices.

Technical Specifications

Digital Signal Processors (DSPs) TNETV1644ZDU6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

EMIF 22 ADDRESS AND 8 DATA BUS AVAILABLE

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

376

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.48 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TNETV1644ZDU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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