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TNETV1002IDZHK

Texas Instruments

TNETV1002IDZHK by Texas Instruments

TNETV1002IDZHK by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at max 100 MHz. It features 32768 RAM words, operates in low power mode, and has an industrial temperature grade. Ideal for digital signal processing applications requiring high performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,056 parts In-Stock

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Digiode

USA . 428 parts In-Stock

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428

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Distributors (Availability)

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AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$7.577

100+ parts

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509

$7.577

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One Stop Electronics

USA . 755 parts In-Stock

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$13.000

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755

$13.000

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Corohmni

South Africa . 553 parts In-Stock

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$42.150

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553

$42.150

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Parana Technologies

USA . 472 parts In-Stock

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$72.354

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472

$72.354

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DigiPath Technology Company

USA . 51 parts In-Stock

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$79.671

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51

$79.671

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ChromeModa Solutions

Germany . 6,439 parts In-Stock

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$81.297

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$66.664

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6,439

$81.297

$66.664

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IDEA Electronic Components Group

UK . 166 parts In-Stock

1+ parts

$81.297

100+ parts

$77.232

1k+ parts

$73.167

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166

$81.297

$77.232

$73.167

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Corphita

USA . 1,206 parts In-Stock

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Microchip USA

USA . 449 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TNETV1002IDZHK by Texas Instruments. As a leader in the industry of Digital Signal Processors, Texas Instruments brings you unparalleled quality and reliability. This versatile product boasts a wide range of applications, providing exceptional performance in various fields. Experience the value and benefits of seamless integration, high-speed processing, and low power consumption. Elevate your projects to new heights with the TNETV1002IDZHK and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.95 V

Operating at a maximum supply voltage of 1.95V ensures efficient power usage.

Address Bus Width: 23

A wider address bus width of 23 allows for more memory locations to be accessed.

Package Shape: SQUARE

The square package shape provides a compact form factor for space-efficient designs.

Bit Size: 16

With a bit size of 16, the product can handle data processing tasks effectively.

Power Supplies (V): 1.8,3.3

Offering multiple power supply options (1.8V, 3.3V) allows compatibility with different systems.

No. of Terminals: 257

Having a high number of terminals (257) enables connectivity with various external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch enhances durability and reliability.

Minimum Supply Voltage: 1.71 V

Operating at a minimum supply voltage of 1.71V ensures stable performance even at low power levels.

Maximum Operating Temperature: 85 °C

Capable of operating at a maximum temperature of 85°C indicates suitability for industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C ensures reliability in various environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy integration and connection in circuit designs.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm allows for slim and compact device profiles.

RAM Words: 32768

With a large RAM word capacity of 32768, the product can handle extensive data processing and storage needs.

Width: 16 mm

A width of 16mm provides a compact footprint for space-constrained applications.

Boundary Scan: YES

The presence of boundary scan capability simplifies testing and debugging processes during development.

External Data Bus Width: 32

An external data bus width of 32 allows for efficient data transfer and processing speeds.

Maximum Clock Frequency: 100 MHz

Operating at a maximum clock frequency of 100MHz enables fast and responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring robust soldering connections.

Peak Reflow Temperature °C: 260

The ability to handle peak reflow temperatures of 260°C ensures reliable soldering during manufacturing processes.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architectures enhances data processing efficiency and speed.

Length: 16 mm

A length of 16mm contributes to a compact and space-efficient design.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range, making it suitable for rugged and demanding environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The product combines digital signal processing capabilities with mixed-signal features for versatile functionality.

Technology: CMOS

Utilizing CMOS technology enables low power consumption and high-speed operation.

Terminal Form: BALL

Having terminal forms in ball shape facilitates reliable soldering connections.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures consistent performance.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting on circuit boards.

Format: FIXED POINT

Utilizing fixed-point format enhances computational accuracy and efficiency.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand standard soldering and reflow processes.

Low Power Mode: YES

The availability of a low power mode option allows for energy-efficient operation and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) TNETV1002IDZHK attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B257

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV1002IDZHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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