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TNETV2665FIBZDUA6

Texas Instruments

TNETV2665FIBZDUA6 by Texas Instruments

TNETV2665FIBZDUA6 by Texas Instruments is a 376-terminal DSP with 32-bit external data bus, operating at up to 30 MHz. It features low power mode, boundary scan, and CMOS technology. Ideal for applications requiring fixed-point format processing in digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,166 parts In-Stock

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Digiode

USA . 4,046 parts In-Stock

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4,046

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Distributors (Availability)

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AZTECH Wire

Italy . 188 parts In-Stock

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$9.610

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188

$9.610

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One Stop Electronics

USA . 608 parts In-Stock

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$14.000

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608

$14.000

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Parana Technologies

USA . 558 parts In-Stock

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$65.832

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558

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Corohmni

South Africa . 5,210 parts In-Stock

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$70.600

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$70.600

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ChromeModa Solutions

Germany . 5,216 parts In-Stock

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$73.969

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$60.655

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5,216

$73.969

$60.655

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IDEA Electronic Components Group

UK . 263 parts In-Stock

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$73.969

100+ parts

$70.271

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$66.572

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263

$73.969

$70.271

$66.572

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Microchip USA

USA . 2,626 parts In-Stock

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$106.720

100+ parts

$104.870

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$103.940

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$103.010

2,626

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$104.870

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$103.010

DigiPath Technology Company

USA . 1,217 parts In-Stock

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$66.690

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Corphita

USA . 813 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TNETV2665FIBZDUA6 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that are reliable and efficient. This versatile product is perfect for a wide range of applications, offering exceptional value and performance to customers. Experience seamless operation and enhanced functionality with the TNETV2665FIBZDUA6, designed to meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

Allows for stable and efficient power supply to the DSP, ensuring optimal performance.

Address Bus Width: 13

Enables the DSP to efficiently handle and process data from different memory locations.

Package Shape: SQUARE

Facilitates easier placement and alignment of the DSP on the circuit board, improving overall manufacturing process.

No. of Terminals: 376

Provides ample connectivity options for external devices and peripherals, enhancing the versatility of the DSP.

Minimum Supply Voltage: 1.14 V

Ensures the DSP can operate at lower power levels, promoting energy efficiency and reducing operating costs.

Maximum Operating Temperature: 90 °C

Allows the DSP to function reliably in a wide range of temperature conditions, making it suitable for various applications.

Minimum Operating Temperature: 0 °C

Ensures the DSP can operate even in low temperature environments, expanding its usability in different settings.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and stable connection between the DSP and external components, reducing the risk of signal interference.

Terminal Position: BOTTOM

Facilitates easier integration of the DSP with other circuit components, optimizing space and layout on the circuit board.

Boundary Scan: YES

Allows for efficient testing and debugging of the DSP during production and maintenance, ensuring high quality and reliability.

External Data Bus Width: 32

Enables the DSP to process a greater amount of data simultaneously, improving performance and speed of data processing.

Maximum Clock Frequency: 30 MHz

Provides fast processing speed and optimal performance for real-time applications, such as audio and video processing.

Peak Reflow Temperature: 260 C

Ensures the DSP can withstand high temperature soldering processes during assembly, improving manufacturing efficiency.

Internal Bus Architecture: MULTIPLE

Facilitates efficient data transfer and communication between different components within the DSP, optimizing overall performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Offers versatile connectivity options and compatibility with various devices and peripherals, enhancing the functionality of the DSP.

Technology: CMOS

Utilizes low power consumption and provides high noise immunity, making the DSP energy efficient and reliable in different operating conditions.

Nominal Supply Voltage: 1.2 V

Ensures stable and consistent power supply for the DSP, promoting reliable performance and longevity of the product.

Format: FIXED POINT

Provides precise and efficient processing of numerical data, making the DSP suitable for applications requiring accurate calculations.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture-induced damage, ensuring the longevity and reliability of the DSP in humid environments.

Low Power Mode: YES

Enables the DSP to conserve energy during idle or low load situations, reducing power consumption and operating costs.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2665FIBZDUA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

376

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TNETV2665FIBZDUA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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