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DSPIC33EP128GS804T-E/ML

Microchip Technology

DSPIC33EP128GS804T-E/ML by Microchip Technology

DSPIC33EP128GS804T-E/ML by Microchip Technology is a 16-bit DSP with 131072 ROM words and 8192 RAM words. It features 17-Ch 12-Bit ADC channels, 1-Ch 12-Bit DAC channels, and peripherals like PWM(16) for automotive applications. Operating at up to 60 MHz with low power mode, it offers connectivity via CAN(2), I2C(2), SPI(3), UART(2).

Median Price

$5.890

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$5.890

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$5.890

-

-

-

Vyrian

USA . 439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

439

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 233 parts In-Stock

1+ parts

$5.530

100+ parts

-

1k+ parts

-

10k+ parts

-

233

$5.530

-

-

-

Continental Prestige Electronics

USA . 5,411 parts In-Stock

1+ parts

$5.890

100+ parts

-

1k+ parts

-

10k+ parts

$5.772

5,411

$5.890

-

-

$5.772

AZTECH Wire

Italy . 323 parts In-Stock

1+ parts

$8.966

100+ parts

-

1k+ parts

-

10k+ parts

-

323

$8.966

-

-

-

Semicontronic

India . 1,406 parts In-Stock

1+ parts

$17.000

100+ parts

$16.575

1k+ parts

$16.490

10k+ parts

-

1,406

$17.000

$16.575

$16.490

-

Ampacity Inc.

Singapore . 648 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

648

$29.000

-

-

-

Aztec Data Supply Inc.

USA . 24,766 parts In-Stock

1+ parts

$54.150

100+ parts

-

1k+ parts

-

10k+ parts

-

24,766

$54.150

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$5.772

1k+ parts

$5.595

10k+ parts

$5.478

2,000

-

$5.772

$5.595

$5.478

QualityLine Systems

Poland . 1,859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,859

-

-

-

-

Argo Parts USA

USA . 1,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,329

-

-

-

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XL Components Corporation

Australia . 1,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,016

-

-

-

-

Marpe Global Electronics

Taiwan . 883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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883

-

-

-

-

Overview

Elevate your projects with the DSPIC33EP128GS804T-E/ML from industry leader Microchip Technology. This top-of-the-line Digital Signal Processor offers unparalleled performance and reliability for a wide range of applications. With features like high-speed operation, low power consumption, and a robust set of peripherals, this product delivers exceptional value to customers seeking cutting-edge technology. Trust Microchip Technology to provide the quality and innovation you need to bring your designs to the next level.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and cost-effective material for packaging.

Surface Mount:

YES - Allows for easy and efficient PCB assembly.

Maximum Supply Voltage:

3.6 V - Supports a wide range of power supply options.

On Chip Data RAM Width:

8 - Provides ample space for data processing.

Screening Level:

AEC-Q100; TS 16949 - Meets automotive industry standards for reliability.

Package Shape:

SQUARE - Space-efficient design for compact applications.

Bit Size:

16 - High processing capability for complex algorithms.

DAC Channels:

YES - Enables analog signal processing capabilities.

No. of Terminals:

44 - Sufficient connectivity options for various peripherals.

Package Style:

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Offers versatility in mounting options.

Minimum Supply Voltage:

3 V - Ensures compatibility with lower power supply sources.

Maximum Operating Temperature:

125 °C - Suitable for harsh operating environments.

No. of External Interrupts:

4 - Allows for quick response to external events.

Minimum Operating Temperature:

40 °C - Operates reliably in extreme cold conditions.

ADC Channels:

YES - Facilitates analog-to-digital signal conversion.

DMA Channels:

YES - Enhances data transfer efficiency.

Terminal Position:

QUAD - Simplifies PCB layout and routing.

ROM Words:

131072 - Large memory capacity for program storage.

Maximum Seated Height:

1 mm - Low-profile design for space-constrained applications.

Digital To Analog Convertors:

1-Ch 12-Bit - Provides high-resolution signal conversion.

RAM Words:

8192 - Sufficient memory for temporary data storage.

Width:

8 mm - Compact form factor for small device designs.

Boundary Scan:

YES - Allows for efficient testing and debugging.

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT - Versatile peripheral options for various applications.

Maximum Clock Frequency:

60 MHz - Supports high-speed data processing.

Internal Bus Architecture:

MULTIPLE - Improves data handling and communication efficiency.

Length:

8 mm - Balanced dimensions for easy integration.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive applications with robust performance.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - Capable of handling digital signal processing tasks efficiently.

No. of Timers:

7 - Facilitates precise timekeeping and event scheduling.

RAM Bytes:

8192 - Sufficient memory capacity for data storage and manipulation.

Technology:

CMOS - Offers low power consumption and high noise immunity.

Terminal Form:

NO LEAD - Lead-free design for environmental friendliness.

Analog To Digital Convertors:

17-Ch 12-Bit - Provides extensive analog signal conversion capabilities.

Maximum Supply Current:

75 mA - Efficient power consumption for extended battery life.

Nominal Supply Voltage:

3.3 V - Standard voltage level for compatibility with existing systems.

No. of DMA Channels:

4 - Enhances data transfer speed and efficiency.

No. of Serial I/Os:

4 - Supports multiple serial communication interfaces.

PWM Channels:

YES - Enables precise control of pulse-width modulation signals.

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2) - Supports various communication protocols for connectivity.

ROM Programmability:

FLASH - Allows for flexible and fast program updates.

Terminal Pitch:

0.65 mm - Fine pitch for compact PCB layout.

Format:

FIXED POINT - Suitable for applications requiring fixed-point math operations.

Low Power Mode:

YES - Supports power-saving features for energy-efficient operation.

Barrel Shifter:

YES - Enhances data manipulation capabilities.

On Chip Program ROM Width:

24 - Ample space for program storage.

No. of I/O Lines:

33 - Sufficient input/output options for external interfacing.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS804T-E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N44

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of I/O Lines:

33

No. of Serial I/Os:

4

No. of Terminals:

44

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

DSPIC33EP128GS804T-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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