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TNETV2665FIBZWT6

Texas Instruments

TNETV2665FIBZWT6 by Texas Instruments

TNETV2665FIBZWT6 by Texas Instruments is a 32-bit DSP with 13-bit address bus width, operating at max 30 MHz clock frequency. Ideal for digital signal processing applications due to low power mode, CMOS technology, and fixed-point format support.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,533 parts In-Stock

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Digiode

USA . 4,188 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 911 parts In-Stock

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$4.000

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911

$4.000

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AZTECH Wire

Italy . 896 parts In-Stock

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$8.097

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Parana Technologies

USA . 1,521 parts In-Stock

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$38.755

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DigiPath Technology Company

USA . 1,378 parts In-Stock

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$42.674

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$39.260

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ChromeModa Solutions

Germany . 6,408 parts In-Stock

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$43.545

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$35.707

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IDEA Electronic Components Group

UK . 94 parts In-Stock

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$43.545

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$41.368

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$39.190

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$52.456

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$51.932

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$49.833

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Corohmni

South Africa . 854 parts In-Stock

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Corphita

USA . 4,410 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TNETV2665FIBZWT6 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality in digital signal processors (DSPs), offering unparalleled performance and reliability. Ideal for a wide range of applications, this product provides customers with value, benefits, and advantages that are unmatched. Discover the endless possibilities that the TNETV2665FIBZWT6 can bring to your projects and elevate your experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and insulation for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Makes it easier to integrate the DSP onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.26 V

Allows for stable and efficient operation without the risk of overloading the DSP.

Address Bus Width: 13

Provides ample address space for handling complex signal processing tasks.

Package Shape: SQUARE

Allows for easy placement and alignment on circuit boards.

No. of Terminals: 361

Offers a high level of connectivity for interfacing with other components.

Minimum Supply Voltage: 1.14 V

Ensures that the DSP can operate reliably even under low voltage conditions.

Maximum Operating Temperature: 90 °C

Can withstand high temperature environments without malfunctioning.

Minimum Operating Temperature: 0 °C

Can also operate effectively in low temperature settings.

Terminal Finish: TIN SILVER COPPER

Provides reliable contacts and good conductivity for optimal performance.

Terminal Position: BOTTOM

Facilitates easy soldering and connecting on circuit boards.

Maximum Seated Height: 1.4 mm

Helps in keeping the overall profile of the assembly compact.

Width: 16 mm

Compact size allows for efficient use of space on circuit boards.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during manufacturing.

External Data Bus Width: 32

Enables high-speed data transfers for fast signal processing.

Maximum Clock Frequency: 30 MHz

Capable of handling high-speed processing tasks efficiently.

Peak Reflow Temperature: 260 C

Can withstand high-temperature reflow soldering processes during assembly.

Internal Bus Architecture: MULTIPLE

Allows for parallel processing of multiple tasks for improved performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

An advanced processor designed specifically for digital signal processing applications.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Nominal Supply Voltage: 1.2 V

Optimal voltage for stable and efficient operation of the DSP.

Terminal Pitch: 0.8 mm

Allows for fine pitch connections, enabling compact design and high density mounting.

Format: FIXED POINT

Suitable for applications that require precise and fixed-point arithmetic operations.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity to moisture, suitable for a range of environmental conditions.

Low Power Mode: YES

Enables the DSP to operate in a power-efficient mode, extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2665FIBZWT6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2665FIBZWT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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