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TNETV2665VIDZWT6

Texas Instruments

TNETV2665VIDZWT6 by Texas Instruments

TNETV2665VIDZWT6 by Texas Instruments is a DSP with 32-bit external data bus, 30 MHz clock frequency, and 13-bit address bus width. Ideal for digital signal processing applications requiring low power mode and fixed point format in a compact grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,246 parts In-Stock

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Digiode

USA . 4,493 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 527 parts In-Stock

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$10.440

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527

$10.440

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One Stop Electronics

USA . 863 parts In-Stock

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$31.000

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863

$31.000

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Parana Technologies

USA . 283 parts In-Stock

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$49.847

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Corohmni

South Africa . 2,536 parts In-Stock

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$54.849

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DigiPath Technology Company

USA . 1,866 parts In-Stock

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$54.888

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$50.497

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1,866

$54.888

$50.497

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ChromeModa Solutions

Germany . 6,008 parts In-Stock

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$56.008

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$45.927

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$56.008

$45.927

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IDEA Electronic Components Group

UK . 1,261 parts In-Stock

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$56.008

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$53.208

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$50.407

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Component Stockers USA

USA . 259 parts In-Stock

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$496.140

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Corphita

USA . 1,238 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TNETV2665VIDZWT6 by Texas Instruments, a leader in the industry. This cutting-edge digital signal processor offers a wide range of applications, from audio processing to telecommunications. With high-quality materials and advanced technology, this product ensures optimal functionality and efficiency. Elevate your projects with the exceptional value and benefits that only Texas Instruments can deliver. Trust in the TNETV2665VIDZWT6 for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Maximum Supply Voltage: 1.26 V

Efficient power usage and lower risk of damage from voltage spikes.

Address Bus Width: 13

Wide address bus allows for efficient memory addressing and processing capabilities.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature conditions, making it versatile for different environments.

Maximum Clock Frequency: 30 MHz

High clock frequency for fast processing speeds and real-time applications.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high noise immunity.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2665VIDZWT6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2665VIDZWT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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