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TNETV2665FIDZWT4

Texas Instruments

TNETV2665FIDZWT4 by Texas Instruments

TNETV2665FIDZWT4 by Texas Instruments is a DSP with 32-bit external data bus, 30 MHz clock frequency, and 13-bit address bus width. Ideal for low power applications in digital signal processing due to its CMOS technology and low profile grid array package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,821 parts In-Stock

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Digiode

USA . 3,573 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 542 parts In-Stock

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$18.254

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$34.922

100+ parts

$34.572

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$33.176

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$34.922

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One Stop Electronics

USA . 1,563 parts In-Stock

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$35.000

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Corohmni

South Africa . 1,974 parts In-Stock

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$44.151

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Parana Technologies

USA . 1,803 parts In-Stock

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$69.932

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DigiPath Technology Company

USA . 82 parts In-Stock

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$77.004

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$70.843

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

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$78.575

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$74.646

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$70.718

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ChromeModa Solutions

Germany . 427 parts In-Stock

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$78.575

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$64.432

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QUARKTWIN TECHNOLOGY LTD

USA . 20,340 parts In-Stock

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Corphita

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Overview

Experience the power of cutting-edge technology with the TNETV2665FIDZWT4 by Texas Instruments, a top-tier manufacturer known for its superior quality and innovative solutions. As part of the Digital Signal Processors category, this product offers unparalleled performance and versatility for a wide range of applications. With a focus on value and benefits, customers can expect seamless integration, enhanced efficiency, and unmatched reliability. Elevate your projects to new heights with the TNETV2665FIDZWT4 and unlock endless possibilities in the world of digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or products with space constraints.

Surface Mount: YES

Surface-mount technology allows for easy PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

Address Bus Width: 13

The wide address bus width allows for efficient data processing and handling of complex algorithms.

Package Shape: SQUARE

The square package shape enables easy and compact integration into electronic systems.

No. of Terminals: 361

The high number of terminals provides ample connectivity options and compatibility with a variety of external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with a low profile and fine pitch design enables high-density mounting, saving space on the PCB.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures stable performance even under low power conditions.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows for reliable operation in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish ensures good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and assembly process, reducing manufacturing complexities.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for slim and compact designs, suitable for space-constrained applications.

Width: 16 mm

The compact width of the product enables versatile placement options in electronic devices.

Boundary Scan: YES

The presence of boundary scan capability facilitates testing and debugging during production, ensuring high-quality output.

External Data Bus Width: 32

The wide external data bus width enables fast data transfer rates and enhanced processing speed.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency allows for rapid data processing and real-time performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures efficient soldering processes and reduces thermal stress on the components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliability during the soldering process and prevents damage to the product.

Internal Bus Architecture: MULTIPLE

The use of multiple internal bus architecture allows for efficient data transfer between different components, enhancing overall performance.

Length: 16 mm

The compact length of the product enables space-saving integration into electronic systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of a digital signal processor as a peripheral IC type indicates specialized processing capabilities for digital signal processing tasks.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high-speed operation, making it suitable for energy-efficient applications.

Terminal Form: BALL

The ball terminal form allows for reliable solder connections and easy integration during PCB assembly.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures stable operation and compatibility with standard power sources.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting and suitable for compact electronic designs.

Format: FIXED POINT

The fixed-point format offers precise computation and control for signal processing applications, ensuring accurate results.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure, requiring standard handling precautions during assembly and storage.

Low Power Mode: YES

The availability of a low power mode allows for energy-efficient operation, extending battery life in portable devices and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2665FIDZWT4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2665FIDZWT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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