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DSPIC33EP128GS808-E/PTVAO

Microchip Technology

DSPIC33EP128GS808-E/PTVAO by Microchip Technology

DSPIC33EP128GS808-E/PTVAO by Microchip is a 16-bit DSP with max clock freq of 60MHz, operating temp range -40 to 125 °C. Ideal for automotive applications, it features flash ROM programmability, CMOS technology, and AEC-Q100 screening level.

Median Price

$6.570

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$6.570

100+ parts

-

1k+ parts

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550

$6.570

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Vyrian

USA . 272 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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272

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 195 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

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195

$1.000

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Continental Prestige Electronics

USA . 1,777 parts In-Stock

1+ parts

$6.570

100+ parts

-

1k+ parts

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10k+ parts

$6.439

1,777

$6.570

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-

$6.439

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.570

100+ parts

$6.439

1k+ parts

-

10k+ parts

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50

$6.570

$6.439

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Semicontronic

India . 998 parts In-Stock

1+ parts

$8.000

100+ parts

$7.800

1k+ parts

$7.760

10k+ parts

-

998

$8.000

$7.800

$7.760

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AZTECH Wire

Italy . 344 parts In-Stock

1+ parts

$9.164

100+ parts

-

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344

$9.164

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Aztec Data Supply Inc.

USA . 3,451 parts In-Stock

1+ parts

$34.920

100+ parts

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3,451

$34.920

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Corohmni

South Africa . 339 parts In-Stock

1+ parts

$40.412

100+ parts

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339

$40.412

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Marpe Global Electronics

Taiwan . 5,590 parts In-Stock

1+ parts

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5,590

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QualityLine Systems

Poland . 5,590 parts In-Stock

1+ parts

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5,590

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XL Components Corporation

Australia . 5,590 parts In-Stock

1+ parts

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100+ parts

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5,590

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Argo Parts USA

USA . 2,667 parts In-Stock

1+ parts

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2,667

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Overview

Experience the power and precision of the DSPIC33EP128GS808-E/PTVAO by Microchip Technology, a renowned leader in digital signal processors. Designed for automotive applications, this cutting-edge device offers unparalleled performance and reliability with its innovative technology and advanced features. With a maximum clock frequency of 60 MHz and a wide operating temperature range, this DSP ensures optimal functionality in any environment. Trust Microchip Technology to deliver top-quality products that exceed your expectations and elevate your projects to new heights. Elevate your designs with the DSPIC33EP128GS808-E/PTVAO and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for flexibility in power requirements, making the product versatile in various applications.

Screening Level: AEC-Q100; TS 16949

Conformance to automotive industry standards ensures reliability and quality, making this product a reliable choice for automotive electronics.

Package Shape: SQUARE

The square shape enables compact PCB design, saving space and allowing for efficient layout of components.

Bit Size: 16

The 16-bit architecture provides sufficient processing power for a wide range of digital signal processing tasks.

No. of Terminals: 80

The high number of terminals allows for versatile connectivity options, enabling integration with various external components and interfaces.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack design with a thin profile and fine pitch enhances thermal performance and allows for high-density mounting on PCBs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption, making the product suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

The high operating temperature range enables reliable performance in harsh environmental conditions, such as automotive engine bays.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme cold conditions, making this product suitable for automotive and industrial applications.

Terminal Position: QUAD

The quad terminal position offers secure connectivity and facilitates easy soldering during PCB assembly.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact and slim designs, ideal for space-constrained applications.

Width: 12 mm

The compact width enables efficient use of PCB real estate and facilitates component layout for optimized performance.

Maximum Clock Frequency: 60 MHz

The high clock frequency enables fast processing of digital signals, making the product suitable for real-time applications.

Length: 12 mm

The compact length contributes to space-saving designs, especially in applications with size constraints.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive environments, meeting stringent industry standards.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The combination of digital signal processing and controller capabilities provides versatile functionality for a wide range of applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the product.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy soldering, ensuring reliable connectivity in demanding applications.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent performance and reliability in various operating conditions.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and efficient updates of firmware and software, enhancing the product's flexibility and usability.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting on PCBs, saving space and allowing for efficient routing of signals.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM provides sufficient memory capacity for storing firmware and software, supporting versatile applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS808-E/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ADC SAMPLE AND HOLD (5-CH 12-BIT)

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

DSPIC33EP128GS808-E/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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