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DSP56303AG100R2

NXP Semiconductors

DSP56303AG100R2 by NXP Semiconductors

NXP Semiconductors' DSP56303AG100R2 is a 144-terminal DSP with 3.6V max supply voltage, 100MHz clock frequency, and 24-bit external data bus width. Ideal for digital signal processing applications requiring low power consumption and high-speed performance in a compact square package.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

DSP56303AG100R2 by NXP Semiconductors
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$1.000

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48

$1.000

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Digiode

USA . 3,388 parts In-Stock

1+ parts

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3,388

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Vyrian

USA . 1,538 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,538

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-

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Anansix

USA . 283 parts In-Stock

1+ parts

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1k+ parts

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283

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Chip Stock

USA . 145 parts In-Stock

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145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,883 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

$0.980

4,883

$1.000

-

-

$0.980

Argo Parts USA

USA . 2,339 parts In-Stock

1+ parts

$1.000

100+ parts

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2,339

$1.000

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One Stop Electronics

USA . 827 parts In-Stock

1+ parts

$4.000

100+ parts

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827

$4.000

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AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$9.029

100+ parts

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443

$9.029

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Ampacity Inc.

Singapore . 1,302 parts In-Stock

1+ parts

$23.000

100+ parts

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1,302

$23.000

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Corohmni

South Africa . 2,609 parts In-Stock

1+ parts

$65.166

100+ parts

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2,609

$65.166

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Microchip USA

USA . 1,841 parts In-Stock

1+ parts

$90.277

100+ parts

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1,841

$90.277

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UNI Independent Distributors

Spain . 6,904 parts In-Stock

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6,904

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Corphita

USA . 939 parts In-Stock

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939

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$0.980

1k+ parts

$0.950

10k+ parts

$0.930

500

-

$0.980

$0.950

$0.930

Overview

Unleash the power of cutting-edge technology with the DSP56303AG100R2 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. This Digital Signal Processor (DSP) is designed for a wide range of applications, offering unparalleled performance and efficiency. Experience seamless operation and innovative features that will take your projects to new heights. Elevate your designs with the DSP56303AG100R2 and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and provides good protection for the DSP, ensuring reliable performance over time.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in different power supply configurations.

Address Bus Width: 18

A wider address bus allows for more memory capacity and better data handling capabilities.

Package Shape: SQUARE

Square package shape is space-efficient and can be easily mounted on the PCB.

No. of Terminals: 144

Having a high number of terminals allows for more connectivity options and functionality in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and extends battery life.

Terminal Finish: TIN

Tin terminal finish provides good solderability and ensures reliable connections on the PCB.

Terminal Position: QUAD

Quad terminal position allows for easy and secure mounting on the PCB, improving overall stability.

Maximum Seated Height: 1.6 mm

Low seated height enables the DSP to be installed in slim devices without adding bulk.

Width: 20 mm

Compact width dimension makes the DSP suitable for small form factor applications.

Boundary Scan: YES

Boundary scan capability simplifies testing and troubleshooting processes during assembly and maintenance.

External Data Bus Width: 24

A wider external data bus allows for faster data transfer and processing speeds.

Maximum Clock Frequency: 100 MHz

High maximum clock frequency enables fast computational performance and real-time processing.

Maximum Time At Peak Reflow Temperature (s): 40

Being able to withstand peak reflow temperatures for 40 seconds ensures robustness during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability and longevity in various temperature conditions.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow efficiency and overall processing speed.

Length: 20 mm

Compact length dimension makes the DSP suitable for space-constrained designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for integration with various signal processing applications.

Technology: CMOS

CMOS technology ensures low power consumption and high performance efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability for secure PCB mounting.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the DSP.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density mounting on the PCB, maximizing space efficiency.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and ensures accurate calculations.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures the DSP can withstand moderate moisture exposure during production and storage.

Low Power Mode: YES

Low power mode feature helps optimize power consumption for energy-efficient operation.

Barrel Shifter: YES

Barrel shifter functionality enhances data shifting operations and improves processing efficiency.

Technical Specifications

Digital Signal Processors (DSPs) DSP56303AG100R2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Address Bus Width:

18

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

DSP56303AG100R2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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