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DSPIC30F4013T-30I/ML

Microchip Technology

DSPIC30F4013T-30I/ML by Microchip Technology

DSPIC30F4013T-30I/ML by Microchip is a 16-bit DSP with max clock freq of 40 MHz, operating temp range -40 to 85 °C. It has 44 terminals, flash ROM programmability, and CMOS technology. Ideal for industrial applications requiring digital signal processing and control functions in a compact chip carrier package.

Median Price

$8.380

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$8.380

100+ parts

-

1k+ parts

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10k+ parts

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1,000

$8.380

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Vyrian

USA . 6,660 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,660

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,750 parts In-Stock

1+ parts

$8.380

100+ parts

-

1k+ parts

-

10k+ parts

$8.212

1,750

$8.380

-

-

$8.212

Ampacity Inc.

Singapore . 213 parts In-Stock

1+ parts

$10.000

100+ parts

-

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213

$10.000

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-

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AZTECH Wire

Italy . 523 parts In-Stock

1+ parts

$12.369

100+ parts

-

1k+ parts

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523

$12.369

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Argo Parts USA

USA . 4,804 parts In-Stock

1+ parts

-

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4,804

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$8.212

1k+ parts

$7.961

10k+ parts

$7.793

2,000

-

$8.212

$7.961

$7.793

Fulton Briggs Corp.

USA . 1,384 parts In-Stock

1+ parts

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1,384

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Overview

Unlock the power of digital signal processing with the DSPIC30F4013T-30I/ML by Microchip Technology. Designed with precision and reliability in mind, this product is a game-changer in the world of digital signal processors. From industrial automation to consumer electronics, the applications are endless. With a maximum clock frequency of 40 MHz and a flash ROM programmability, this DSP offers unparalleled performance and flexibility. Trust in Microchip Technology to deliver top-notch quality and cutting-edge technology. Elevate your projects with the DSPIC30F4013T-30I/ML and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and insulation for the DSP, ensuring long-term reliability.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power sources, providing stability and reliability in various operating conditions.

Bit Size: 16

The 16-bit size allows for efficient processing of data and complex algorithms, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature ensures that the DSP can function effectively in both extreme cold and hot environments.

Maximum Clock Frequency: 40 MHz

The high clock frequency allows for fast data processing, making the DSP suitable for real-time applications and signal processing tasks.

ROM Programmability: FLASH

The ROM programmability with flash memory allows for easy and quick updates to the DSP's firmware or software, enhancing its versatility and adaptability.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F4013T-30I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

44

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC30F4013T-30I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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