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TMS320VC5416GWS120

Texas Instruments

TMS320VC5416GWS120 by Texas Instruments

TMS320VC5416GWS120 by Texas Instruments is a 16-bit DSP with 131072 RAM words, 20 MHz clock frequency, and 1.5V supply voltage. Ideal for industrial applications requiring low power consumption, it features a square package shape, boundary scan support, and on-chip data RAM width of 16 bits.

Median Price

$35.740

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,574 parts In-Stock

1+ parts

$39.899

100+ parts

$35.466

1k+ parts

$26.078

10k+ parts

-

5,574

$39.899

$35.466

$26.078

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Chip1Stop

Japan . 160 parts In-Stock

1+ parts

-

100+ parts

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$31.580

10k+ parts

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160

-

-

$31.580

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Distributors (In-Stock)

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Digiode

USA . 1,195 parts In-Stock

1+ parts

$37.904

100+ parts

-

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1,195

$37.904

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Nova Conductors

Japan . 50 parts In-Stock

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$40.082

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50

$40.082

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Vyrian

USA . 4,126 parts In-Stock

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4,126

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TME

Poland . 800 parts In-Stock

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$50.310

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800

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$50.310

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,821 parts In-Stock

1+ parts

$22.799

100+ parts

$2,117.245

1k+ parts

$20.519

10k+ parts

-

1,821

$22.799

$2,117.245

$20.519

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DigiPath Technology Company

USA . 1,133 parts In-Stock

1+ parts

$25.105

100+ parts

-

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1,133

$25.105

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ChromeModa Solutions

Germany . 2,950 parts In-Stock

1+ parts

$25.617

100+ parts

$21.006

1k+ parts

-

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2,950

$25.617

$21.006

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IDEA Electronic Components Group

UK . 2,240 parts In-Stock

1+ parts

$25.617

100+ parts

$24.336

1k+ parts

$23.055

10k+ parts

-

2,240

$25.617

$24.336

$23.055

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Corohmni

South Africa . 2,393 parts In-Stock

1+ parts

$34.204

100+ parts

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2,393

$34.204

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Corphita

USA . 4,588 parts In-Stock

1+ parts

$35.909

100+ parts

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4,588

$35.909

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Continental Prestige Electronics

USA . 940 parts In-Stock

1+ parts

$40.082

100+ parts

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10k+ parts

$39.280

940

$40.082

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$39.280

Ampacity Inc.

Singapore . 1,457 parts In-Stock

1+ parts

$58.420

100+ parts

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1,457

$58.420

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Microchip USA

USA . 1,542 parts In-Stock

1+ parts

$89.580

100+ parts

$88.020

1k+ parts

$87.240

10k+ parts

$86.460

1,542

$89.580

$88.020

$87.240

$86.460

QUARKTWIN TECHNOLOGY LTD

USA . 25,540 parts In-Stock

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Argo Parts USA

USA . 4,304 parts In-Stock

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4,304

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Overview

Experience superior performance and efficiency with the TMS320VC5416GWS120 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and innovative digital signal processors (DSPs) for a wide range of applications. The TMS320VC5416GWS120 offers exceptional value with its advanced features and capabilities, making it the perfect choice for your next project. Unlock new possibilities and achieve optimal results with this high-quality product. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

With surface mount technology, this DSP can be easily integrated onto circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.65 V

The low maximum supply voltage helps in minimizing power consumption and heat dissipation, making it energy-efficient.

On Chip Data RAM Width: 16

A wide on-chip data RAM width of 16 bits allows for fast data processing and efficient memory access in real-time applications.

Address Bus Width: 23

The wide address bus width of 23 bits enables the DSP to access a large memory space and handle complex algorithms effectively.

Package Shape: SQUARE

The square package shape ensures easy handling and efficient layout on PCBs, optimizing space utilization in electronic designs.

Bit Size: 16

The 16-bit architecture provides a good balance between computational power and memory efficiency, suitable for a wide range of signal processing tasks.

No. of Terminals: 144

The high number of terminals allows for versatile connectivity options and interface flexibility in various system configurations.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high signal density and reliable connections in compact form factors.

Minimum Supply Voltage: 1.42 V

The low minimum supply voltage ensures stable operation and reliability even under low-power conditions, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this DSP is suitable for industrial applications requiring robust performance in harsh environments.

No. of External Interrupts: 4

Having 4 external interrupts enables efficient handling of external events and real-time signal processing with minimal delay.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 to 85°C allows this DSP to perform reliably in extreme temperature conditions.

Terminal Finish: TIN LEAD

The use of tin-lead terminal finish ensures excellent solderability and long-term reliability in various assembly processes.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier to integrate this DSP into compact electronic designs.

Maximum Seated Height: 1.4 mm

The low maximum seated height enables slim and compact device designs, suitable for applications with space constraints.

RAM Words: 131072

With 131072 RAM words, this DSP offers ample memory storage for data processing, enabling efficient execution of complex algorithms.

Width: 12 mm

The compact width of 12 mm allows for space-efficient placement on PCBs and facilitates compact system designs in various applications.

Boundary Scan: YES

The inclusion of boundary scan capability simplifies testing and debugging processes, ensuring high product quality and reliability.

External Data Bus Width: 16

The wide external data bus width of 16 bits enables high-speed data transfer and efficient communication with external devices.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency of 20 MHz provides fast data processing and real-time responsiveness, suitable for demanding signal processing tasks.

Maximum Time At Peak Reflow Temperature (s): 20

The short maximum time at peak reflow temperature of 20 seconds ensures safe and precise soldering during manufacturing processes.

Peak Reflow Temperature °C: 220

The high peak reflow temperature of 220°C ensures reliable solder joints and robust assembly in various temperature environments.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data transfer and parallel processing, enhancing overall performance and speed.

Length: 12 mm

The compact length of 12 mm facilitates space-saving design layouts and efficient integration into small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making this DSP suitable for rugged applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types expands the functionality and versatility of this DSP, enabling broader application compatibility.

Technology: CMOS

The CMOS technology used in this DSP offers low power consumption, high noise immunity, and fast switching speeds, making it energy-efficient and reliable.

Terminal Form: BALL

The use of ball terminal form provides reliable connections and facilitates easy assembly, ensuring robust performance in various applications.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V offers a balance between power efficiency and performance, making this DSP suitable for a wide range of applications.

No. of DMA Channels: 6

With 6 DMA channels, this DSP can efficiently manage data transfers and optimize system performance in multi-tasking and high-throughput applications.

ROM Programmability: MROM

The MROM programmability offers reliable and secure data storage, ensuring data integrity and system stability in critical applications.

Terminal Pitch: 0.8 mm

The narrow terminal pitch of 0.8 mm allows for high signal density and compact PCB design, optimizing space utilization in electronic systems.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency, making this DSP ideal for real-time signal processing tasks.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this DSP can withstand moderate exposure to moisture during storage and assembly processes.

Low Power Mode: YES

The low power mode feature enables energy-efficient operation, extending battery life and reducing power consumption in battery-powered devices.

Barrel Shifter: YES

The inclusion of a barrel shifter allows for efficient data manipulation and bit shifting operations, enhancing computational efficiency in signal processing tasks.

On Chip Program ROM Width: 16

The on-chip program ROM width of 16 bits provides ample storage for program instructions and enhances the speed and efficiency of program execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5416GWS120 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5416GWS120 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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