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DSP56311VL150

NXP Semiconductors

DSP56311VL150 by NXP Semiconductors

NXP Semiconductors' DSP56311VL150 is a 150 MHz DSP with 24-bit external data bus width and 18-bit address bus width. Ideal for digital signal processing applications, it features low power mode, barrel shifter, and boundary scan support.

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Ampacity Inc.

Singapore . 283 parts In-Stock

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Semicontronic

India . 183 parts In-Stock

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AZTECH Wire

Italy . 411 parts In-Stock

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Benley Electronics

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Advanced Electronics

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Corohmni

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Modulus Dynamics

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Overview

Experience unparalleled performance and efficiency with the DSP56311VL150 by NXP Semiconductors. As a leader in the industry, NXP delivers top-notch quality and reliability in their products. This digital signal processor is perfect for a wide range of applications, offering high-speed processing and low power consumption. With its cutting-edge technology and advanced features, this DSP provides exceptional value and benefits to customers looking for superior performance in their designs. Upgrade your projects with the DSP56311VL150 and unleash the full potential of your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount technology makes it easy to integrate the DSP into circuit boards, leading to a more compact and efficient design.

Maximum Supply Voltage: 1.9 V

The high maximum supply voltage allows for flexibility in power input, accommodating various power sources and requirements.

Address Bus Width: 18

A wider address bus allows for more memory addressing capability, enabling the DSP to handle larger data sets and complex algorithms.

No. of Terminals: 196

Having a high number of terminals provides ample connectivity options for interfacing with other components and peripherals in the system.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage ensures efficient power consumption, making the DSP suitable for battery-powered devices or low-power applications.

Maximum Clock Frequency: 150 MHz

With a high maximum clock frequency, the DSP can process data at a rapid rate, making it well-suited for applications requiring real-time signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Technical Specifications

Digital Signal Processors (DSPs) DSP56311VL150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

18

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DSP56311VL150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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