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TMS320F2806NMFA

Texas Instruments

TMS320F2806NMFA by Texas Instruments

TMS320F2806NMFA by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for industrial applications due to its low power mode, FLASH ROM programmability, and multiple internal bus architecture. It features ADC channels, PWM channels, and 3 timers for efficient signal processing tasks.

Median Price

$27.010

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 538 parts In-Stock

1+ parts

$16.812

100+ parts

$14.686

1k+ parts

$10.128

10k+ parts

-

538

$16.812

$14.686

$10.128

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DigiKey

USA . 184 parts In-Stock

1+ parts

$27.010

100+ parts

$20.450

1k+ parts

$17.856

10k+ parts

-

184

$27.010

$20.450

$17.856

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Mouser Electronics

USA . 184 parts In-Stock

1+ parts

$27.010

100+ parts

$18.540

1k+ parts

$18.080

10k+ parts

-

184

$27.010

$18.540

$18.080

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,993 parts In-Stock

1+ parts

$15.971

100+ parts

-

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-

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3,993

$15.971

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Nova Conductors

Japan . 85 parts In-Stock

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$17.620

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-

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85

$17.620

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Vyrian

USA . 7,797 parts In-Stock

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7,797

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Cyclops Electronics Ltd

UK . 2,425 parts In-Stock

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2,425

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Sensible Micro Corp

USA . 2,290 parts In-Stock

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2,290

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Distributors (Availability)

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AZTECH Wire

Italy . 687 parts In-Stock

1+ parts

$5.490

100+ parts

-

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687

$5.490

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Ampacity Inc.

Singapore . 419 parts In-Stock

1+ parts

$14.290

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-

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419

$14.290

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Corphita

USA . 2,107 parts In-Stock

1+ parts

$15.131

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2,107

$15.131

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Continental Prestige Electronics

USA . 1,973 parts In-Stock

1+ parts

$17.620

100+ parts

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1k+ parts

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$17.268

1,973

$17.620

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-

$17.268

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$17.620

100+ parts

-

1k+ parts

$16.739

10k+ parts

$16.387

1,000

$17.620

-

$16.739

$16.387

Corohmni

South Africa . 351 parts In-Stock

1+ parts

$30.495

100+ parts

-

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351

$30.495

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Parana Technologies

USA . 1,249 parts In-Stock

1+ parts

$32.839

100+ parts

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1k+ parts

$113.209

10k+ parts

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1,249

$32.839

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$113.209

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ChromeModa Solutions

Germany . 2,139 parts In-Stock

1+ parts

$36.898

100+ parts

$30.256

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2,139

$36.898

$30.256

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IDEA Electronic Components Group

UK . 857 parts In-Stock

1+ parts

$36.898

100+ parts

$35.053

1k+ parts

$33.208

10k+ parts

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857

$36.898

$35.053

$33.208

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Microchip USA

USA . 1,866 parts In-Stock

1+ parts

$55.270

100+ parts

$54.480

1k+ parts

$54.090

10k+ parts

$53.690

1,866

$55.270

$54.480

$54.090

$53.690

iodParts Technologies Inc.

India . 5,426 parts In-Stock

1+ parts

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5,426

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Argo Parts USA

USA . 3,241 parts In-Stock

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3,241

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Lixinc

USA . 1,657 parts In-Stock

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1,657

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DigiPath Technology Company

USA . 1,634 parts In-Stock

1+ parts

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100+ parts

$33.267

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1,634

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$33.267

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Overview

Experience the power of cutting-edge technology with the TMS320F2806NMFA by Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor is perfect for a wide range of applications, offering top-notch performance and reliability. With its advanced features and high-quality design, this product provides exceptional value and benefits to customers looking for a superior solution for their digital signal processing needs. Trust Texas Instruments to deliver excellence in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology makes installation and assembly easier, saving time and effort in production.

Maximum Supply Voltage: 1.89 V

This high supply voltage allows for robust performance and stability in various operating conditions.

On Chip Data RAM Width: 16

The wide data RAM width enables faster data processing and efficient multitasking capabilities.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space and easy integration into circuits.

Bit Size: 32

With a 32-bit architecture, this DSP offers high precision and accuracy in calculations and signal processing tasks.

No. of Terminals: 100

Having a large number of terminals allows for versatile connectivity options and interfaces with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style ensures secure mounting, compact design, and optimal signal transmission for enhanced performance.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage requirement enables energy-efficient operation and extends the battery life of portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions and industrial applications.

CPU Family: C28X

The C28X CPU family offers powerful processing capabilities and advanced features for demanding signal processing tasks.

No. of External Interrupts: 3

Having multiple external interrupts allows for responsive handling of external events and real-time signal processing.

Minimum Operating Temperature: -40 °C

The DSP can operate in extreme cold temperatures, making it suitable for applications in challenging environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish ensures reliable electrical connections and prevents corrosion for long-lasting performance.

ADC Channels: YES

The presence of ADC channels enables analog signal conversion for processing and analysis in various applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies board layout and assembly, making it easier to integrate the DSP into electronic systems.

Maximum Seated Height: 1.4 mm

The low seated height allows for compact design and compatibility with slim devices and space-constrained applications.

RAM Words: 10240

With a large RAM capacity, the DSP can store and process a significant amount of data, enhancing performance and functionality.

Width: 10 mm

The compact width of the DSP facilitates integration into small form factor devices and space-limited applications.

Boundary Scan: YES

Boundary scan technology enables efficient testing and debugging of the DSP during development and production stages.

Maximum Clock Frequency: 100 MHz

The high clock frequency allows for fast processing speed and real-time operation in demanding signal processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time minimizes the risk of component damage and ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures proper soldering and thermal stability of the DSP in manufacturing processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency and supports simultaneous processing of multiple tasks.

Length: 10 mm

The compact length of the DSP contributes to space-saving design and compatibility with small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh temperature conditions and rugged environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type offers versatile connectivity options and additional features for diverse signal processing applications.

No. of Timers: 3

Having multiple timers allows for precise timing control and synchronization of operations in signal processing tasks.

RAM Bytes: 20480

The high RAM capacity in bytes enables efficient data storage and processing, supporting complex algorithms and calculations.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliable performance for the DSP in various applications.

Terminal Form: BALL

The ball terminal form provides secure connections and facilitates soldering during installation, ensuring stable electrical contact.

Maximum Supply Current: 230 mA

The moderate supply current requirement allows for efficient power usage and extends battery life in portable devices.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage ensures stable and consistent power delivery to the DSP for reliable operation in different scenarios.

PWM Channels: YES

The presence of PWM channels enables precise control of pulse width modulation signals for accurate and efficient signal processing.

ROM Programmability: FLASH

Flash ROM programmability enables flexible and reprogrammable memory storage for firmware updates and customization of the DSP.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for compact and space-efficient design, ideal for miniaturized electronic devices and applications.

Format: FLOATING POINT

The floating-point format supports high precision arithmetic operations and complex calculations, making it suitable for scientific and signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, ensuring reliability and performance of the DSP in various environmental conditions.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation, reducing power consumption and extending battery life in portable devices.

On Chip Program ROM Width: 16

A wide on-chip program ROM width enables efficient storage and execution of programs, enhancing the processing speed and performance of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2806NMFA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

20480

RAM Words:

10240

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2806NMFA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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