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TMS320C6657CZH

Texas Instruments

TMS320C6657CZH by Texas Instruments

TMS320C6657CZH by Texas Instruments is a 32-bit DSP with integrated cache and 8-bit on-chip data RAM. It features 24-bit address bus width, 16-bit external data bus width, and 72 DMA channels. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

$87.824

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 344 parts In-Stock

1+ parts

$82.733

100+ parts

$80.244

1k+ parts

$62.205

10k+ parts

-

344

$82.733

$80.244

$62.205

-

DigiKey

USA . 60 parts In-Stock

1+ parts

$130.020

100+ parts

$100.800

1k+ parts

-

10k+ parts

-

60

$130.020

$100.800

-

-

Chip1Stop

Japan . 60 parts In-Stock

1+ parts

-

100+ parts

$87.824

1k+ parts

-

10k+ parts

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60

-

$87.824

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,641 parts In-Stock

1+ parts

$78.596

100+ parts

-

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-

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3,641

$78.596

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$90.190

100+ parts

-

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50

$90.190

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Vyrian

USA . 5,062 parts In-Stock

1+ parts

-

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5,062

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Chip Stock

USA . 2,988 parts In-Stock

1+ parts

-

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2,988

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Bristol Electronics

USA . 46 parts In-Stock

1+ parts

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46

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Sensible Micro Corp

USA . 33 parts In-Stock

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33

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ComSIT Distribution GmbH

Germany . 22 parts In-Stock

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22

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Lantek

USA . 10 parts In-Stock

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10

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Semtec, LLC

USA . 6 parts In-Stock

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6

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 687 parts In-Stock

1+ parts

$11.800

100+ parts

-

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-

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687

$11.800

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Parana Technologies

USA . 2,153 parts In-Stock

1+ parts

$66.651

100+ parts

-

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2,153

$66.651

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Ampacity Inc.

Singapore . 155 parts In-Stock

1+ parts

$70.320

100+ parts

-

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155

$70.320

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Semicontronic

India . 155 parts In-Stock

1+ parts

$70.320

100+ parts

$68.562

1k+ parts

$68.210

10k+ parts

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155

$70.320

$68.562

$68.210

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Corphita

USA . 583 parts In-Stock

1+ parts

$74.460

100+ parts

-

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583

$74.460

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ChromeModa Solutions

Germany . 3,121 parts In-Stock

1+ parts

$74.889

100+ parts

$61.409

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-

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3,121

$74.889

$61.409

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IDEA Electronic Components Group

UK . 476 parts In-Stock

1+ parts

$74.889

100+ parts

$71.145

1k+ parts

$67.400

10k+ parts

-

476

$74.889

$71.145

$67.400

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Continental Prestige Electronics

USA . 2,812 parts In-Stock

1+ parts

$81.812

100+ parts

-

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-

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$80.176

2,812

$81.812

-

-

$80.176

Corohmni

South Africa . 4,898 parts In-Stock

1+ parts

$81.812

100+ parts

-

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4,898

$81.812

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$84.266

100+ parts

$80.053

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$80.053

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450

$84.266

$80.053

$80.053

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$90.190

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1,000

$90.190

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Modulus Dynamics

Lithuania . 450 parts In-Stock

1+ parts

$90.811

100+ parts

$89.903

1k+ parts

$87.179

10k+ parts

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450

$90.811

$89.903

$87.179

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Lixinc

USA . 9,001 parts In-Stock

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9,001

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A-Z Elektronik GmbH

Germany . 6,560 parts In-Stock

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6,560

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iodParts Technologies Inc.

India . 5,820 parts In-Stock

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5,820

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Argo Parts USA

USA . 1,721 parts In-Stock

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1,721

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Kepictronics

USA . 1,520 parts In-Stock

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1,520

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DigiPath Technology Company

USA . 1,400 parts In-Stock

1+ parts

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$67.520

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1,400

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$67.520

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$81.344

1k+ parts

$81.344

10k+ parts

$81.344

500

-

$81.344

$81.344

$81.344

Perfect Parts

USA . 72 parts In-Stock

1+ parts

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72

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the TMS320C6657CZH by Texas Instruments, a cutting-edge Digital Signal Processor that offers unparalleled quality and performance. As a leader in the industry, Texas Instruments delivers top-notch products with integrated cache and advanced technology to meet all your processing needs. From audio and video processing to telecommunications, this DSP is designed to excel in a variety of applications. Experience the value and benefits of this product as it provides fast and efficient processing, making it a game-changer for your projects. Upgrade your systems today with the TMS320C6657CZH and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Integrated Cache: YES

The presence of integrated cache improves processing speed and efficiency.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving design.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width enhances data processing capabilities.

Address Bus Width: 24

The 24-bit address bus width enables access to a larger memory space for enhanced performance.

Package Shape: SQUARE

The square package shape ensures efficient use of space and easy integration into circuit boards.

Bit Size: 32

The 32-bit bit size provides high processing power and accuracy.

Power Supplies (V): 1,1.5,1.8

The availability of multiple power supply options offers flexibility in different operating conditions.

No. of Terminals: 625

With 625 terminals, there are ample connectivity options for various peripherals and interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enhances signal integrity and reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures product reliability in diverse environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in various temperature conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides corrosion resistance and improved electrical conductivity.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and assembly.

Maximum Seated Height: 2.99 mm

The maximum seated height ensures compatibility with compact electronic devices.

RAM Words: 8192

The 8192 RAM words capacity allows for storing and processing large amounts of data.

Width: 21 mm

The 21mm width makes the product suitable for compact applications with limited space.

Boundary Scan: YES

The boundary scan feature aids in debugging and testing PCB interconnections.

External Data Bus Width: 16

The 16-bit external data bus width enables high-speed data transfer between components.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance ensures reliability during the soldering process.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data processing efficiency and speed.

Length: 21 mm

The 21mm length allows for compact placement within electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type indicates a versatile device suitable for various applications.

No. of Timers: 8

With 8 timers, the product can handle multiple timing functions simultaneously.

Technology: CMOS

The CMOS technology provides low power consumption and high-speed operation.

Terminal Form: BALL

The ball terminal form ensures reliable electrical connections with the PCB.

No. of DMA Channels: 72

The 72 DMA channels enable efficient data transfer and processing capabilities.

ROM Programmability: MROM

The MROM ROM programmability allows for secure and permanent data storage.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch facilitates high-density PCB layouts.

Format: FLOATING POINT

The floating-point format enables precise numerical calculations and data processing.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resistance to moisture and environmental factors.

Low Power Mode: YES

The low power mode feature helps in conserving energy and extending battery life.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width enhances program storage capacity and performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6657CZH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

625

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.99 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6657CZH Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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