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ADSP-21062LKSZ-160

Analog Devices

ADSP-21062LKSZ-160 by Analog Devices

ADSP-21062LKSZ-160 by Analog Devices is a 32-bit DSP with 3.3V power supply, operating up to 40MHz. Ideal for digital signal processing applications, it features a 48-bit external data bus width and boundary scan capability. With low power mode and barrel shifter, this CMOS technology-based processor offers high performance in a compact square package.

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Vyrian

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Nova Conductors

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Chip Stock

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Digiode

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Semicontronic

India . 1,571 parts In-Stock

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Ampacity Inc.

Singapore . 1,083 parts In-Stock

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AZTECH Wire

Italy . 380 parts In-Stock

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Parana Technologies

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IDEA Electronic Components Group

UK . 899 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,092 parts In-Stock

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One Stop Electronics

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Advanced Electronics

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DigiPath Technology Company

USA . 1,374 parts In-Stock

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Corohmni

South Africa . 339 parts In-Stock

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Vigor

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Continental Prestige Electronics

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Lixinc

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Argo Parts USA

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Overview

Unlock the power of advanced signal processing with the ADSP-21062LKSZ-160 by Analog Devices. Renowned for their top-quality products, Analog Devices brings you a state-of-the-art Digital Signal Processor that offers unparalleled performance and reliability. Ideal for applications in telecommunications, audio processing, and industrial automation, this DSP provides customers with exceptional value, superior benefits, and unmatched advantages. Experience the difference with Analog Devices and elevate your projects to new heights with the ADSP-21062LKSZ-160.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 3.45 V

A higher maximum supply voltage provides flexibility in power supply options.

Address Bus Width: 32

A wider address bus allows for larger memory addressing capabilities.

Package Shape: SQUARE

Square package shape is space-efficient and suitable for compact designs.

Bit Size: 32

A 32-bit architecture enables high processing power and data handling capacity.

Power Supplies (V): 3.3

Reliable and stable power supply at 3.3 volts ensures consistent performance.

No. of Terminals: 240

A higher number of terminals allow for more connectivity options and interface possibilities.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, FINE PITCH

Multiple package styles cater to various mounting and cooling requirements.

Minimum Supply Voltage: 3.15 V

A low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environments.

No. of External Interrupts: 3

Multiple external interrupts support efficient multitasking and real-time event handling.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in various temperature conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Terminal Position: QUAD

Quad terminal configuration facilitates easy connections and soldering on PCBs.

Maximum Seated Height: 4.1 mm

Low seated height enables a compact overall product design.

RAM Words: 2M

Large RAM capacity allows for efficient data storage and processing.

Width: 32 mm

Compact width size is suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging during product development.

External Data Bus Width: 48

Wider external data bus width enables faster data transfer rates.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast and efficient signal processing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints during manufacturing.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency.

Length: 32 mm

Compact length size contributes to a smaller overall product footprint.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances product interoperability and functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability in soldered connections.

Maximum Supply Current: 530 mA

A higher maximum supply current allows for powering more peripherals and components.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation.

No. of DMA Channels: 10

Multiple DMA channels support efficient data transfer and processing.

No. of Serial I/Os: 2

Multiple serial I/Os enable flexible connectivity options for external communication.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and miniaturization.

Format: FLOATING POINT

Floating-point format enhances precision in mathematical calculations and signal processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 provides guidelines for moisture-resistant handling and storage of the component.

Low Power Mode: YES

Low power mode option helps in conserving energy and extending battery life.

Barrel Shifter: YES

Barrel shifter capability enhances data manipulation and processing efficiency.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21062LKSZ-160 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

48

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G240

JESD-609 Code:

e3

Length:

32 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

10

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

240

No. of Timers:

1

On Chip Data RAM Width:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP240,1.3SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2M

Maximum Seated Height:

4.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

530 mA

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

32 mm

Peripheral IC Type:

Trade Compliance

ADSP-21062LKSZ-160 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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