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TMS320VC5509AGHHR

Texas Instruments

TMS320VC5509AGHHR by Texas Instruments

TMS320VC5509AGHHR by Texas Instruments is a DSP with 16-bit data RAM, 21-bit address bus, and 128K RAM words. It operates at a max frequency of 50 MHz and has low power mode for industrial applications. With a package style of grid array and terminal finish of tin lead, it's suitable for digital signal processing tasks requiring high performance in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,775 parts In-Stock

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Digiode

USA . 1,336 parts In-Stock

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1,336

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Semicontronic

India . 326 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

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326

$4.000

$3.900

$3.880

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One Stop Electronics

USA . 414 parts In-Stock

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$13.000

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414

$13.000

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AZTECH Wire

Italy . 626 parts In-Stock

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$17.513

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626

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Ampacity Inc.

Singapore . 736 parts In-Stock

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$20.000

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736

$20.000

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Parana Technologies

USA . 1,447 parts In-Stock

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$20.246

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$20.236

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$20.246

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$20.236

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DigiPath Technology Company

USA . 1,944 parts In-Stock

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$22.293

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$20.510

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1,944

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ChromeModa Solutions

Germany . 5,580 parts In-Stock

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$22.748

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$18.653

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$22.748

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IDEA Electronic Components Group

UK . 1,265 parts In-Stock

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$22.748

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$21.611

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$20.473

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1,265

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$21.611

$20.473

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Corohmni

South Africa . 1,149 parts In-Stock

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$51.269

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1,149

$51.269

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$84.264

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$80.051

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$80.051

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600

$84.264

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$80.051

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Continental Prestige Electronics

USA . 5,554 parts In-Stock

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Corphita

USA . 3,718 parts In-Stock

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Argo Parts USA

USA . 1,803 parts In-Stock

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Microchip USA

USA . 419 parts In-Stock

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419

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Experience unparalleled performance and reliability with the TMS320VC5509AGHHR by Texas Instruments, a leading manufacturer in the industry. As a Digital Signal Processor (DSP), this product offers advanced capabilities suitable for various applications. From its low power mode to its high clock frequency, this DSP provides exceptional value and benefits to customers seeking cutting-edge technology. Elevate your projects with the TMS320VC5509AGHHR and unlock new possibilities in the world of signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy mounting on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.65 V

Operates efficiently at low supply voltage, saving power and reducing heat dissipation.

On Chip Data RAM Width: 16

Wide on-chip data RAM width allows for faster data processing and manipulation.

Address Bus Width: 21

Wide address bus width allows for accessing a larger memory space, essential for complex signal processing tasks.

Package Shape: SQUARE

Square package shape enables easy integration into PCB layouts, optimizing space usage.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes the product suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for operation in extreme cold conditions.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer speeds and throughput, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processor and additional peripheral IC types enable versatile signal processing capabilities for various applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5509AGHHR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2V AND 1.35V SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

179

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

128K

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5509AGHHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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