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TMS320DM8168CCYG4

Texas Instruments

TMS320DM8168CCYG4 by Texas Instruments

TMS320DM8168CCYG4 by Texas Instruments is a 32-bit DSP with integrated cache, 15-bit address bus width, and 32-bit external data bus width. Ideal for applications requiring high-performance digital signal processing, it features low power mode, multiple internal bus architecture, and boundary scan capability.

Median Price

$145.200

Lifecycle Status

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9

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1k+

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Texas Instruments

USA . 1,778 parts In-Stock

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$132.850

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$120.252

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$114.526

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Rochester

USA . 1 parts In-Stock

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$157.550

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$148.100

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$138.640

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$157.550

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$138.640

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Distributors (In-Stock)

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Component Electronics Inc.

Canada . 1 parts In-Stock

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$115.380

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$86.540

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$75.000

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$115.380

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Digiode

USA . 2,671 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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Resion

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Martec Srl

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Distributors (Availability)

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AZTECH Wire

Italy . 251 parts In-Stock

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$9.780

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Corohmni

South Africa . 1,204 parts In-Stock

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Parana Technologies

USA . 1,955 parts In-Stock

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$45.412

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DigiPath Technology Company

USA . 861 parts In-Stock

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$50.004

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$46.004

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ChromeModa Solutions

Germany . 3,545 parts In-Stock

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$51.025

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$41.840

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IDEA Electronic Components Group

UK . 951 parts In-Stock

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$51.025

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$48.474

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$45.922

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Ampacity Inc.

Singapore . 872 parts In-Stock

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Semicontronic

India . 634 parts In-Stock

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Corphita

USA . 3,842 parts In-Stock

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$119.565

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Component Stockers USA

USA . 1,966 parts In-Stock

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Continental Prestige Electronics

USA . 6,946 parts In-Stock

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$159.377

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Microchip USA

USA . 1,516 parts In-Stock

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$170.760

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$166.210

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Lixinc

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Futuretech Components

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Perfect Parts

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Kepictronics

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Netroflash

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Overview

Unlock unparalleled processing power with the TMS320DM8168CCYG4 by Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments guarantees top-notch quality and reliability. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Say goodbye to limitations and embrace endless possibilities with the TMS320DM8168CCYG4. Experience superior performance and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components, making it a reliable choice.

Integrated Cache: YES

With integrated cache, this DSP can quickly access frequently used data, enhancing performance.

Surface Mount: YES

The surface mount capability makes it easy to install and integrate into various electronic devices.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage ensures safe operation and prevents damage due to voltage spikes.

Address Bus Width: 15

The wider address bus allows for efficient memory access, improving data processing speed.

Package Shape: SQUARE

The square shape provides a compact design, ideal for space-constrained applications.

Bit Size: 32

The 32-bit architecture enables processing of large amounts of data quickly and accurately.

No. of Terminals: 1031

The high number of terminals allows for versatile connectivity options with other components.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

This package style enhances heat dissipation and overall performance of the DSP.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage ensures efficient power consumption and extends the product's lifespan.

Maximum Operating Temperature: 95 °C

The high operating temperature range allows the DSP to function reliably in various environments.

Minimum Operating Temperature: 0 °C

The low operating temperature range ensures the DSP can operate in cold environments without issues.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish provides a reliable connection and prevents corrosion over time.

Terminal Position: BOTTOM

The terminal position makes it easy to connect the DSP to other components on a circuit board.

Maximum Seated Height: 3.31 mm

The low seated height is beneficial for slim electronic devices with height restrictions.

RAM Words: 16384

The ample RAM capacity allows for efficient data storage and processing in real-time applications.

Width: 25 mm

The compact width makes this DSP suitable for small form factor devices.

Boundary Scan: YES

The boundary scan feature simplifies testing and debugging processes during development and production.

External Data Bus Width: 32

The wide external data bus width allows for fast data transfer between the DSP and external components.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures secure soldering during the manufacturing process.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and processing capabilities.

Length: 25 mm

The compact length of the DSP facilitates integration into various electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type provides versatile communication and data processing capabilities.

No. of Timers: 8

The existence of 8 timers allows for efficient task scheduling and time-sensitive operations.

Technology: CMOS

The CMOS technology offers low power consumption, making the DSP energy-efficient.

Terminal Form: BALL

The ball-terminal form provides a secure connection and ease of soldering during assembly.

Nominal Supply Voltage: 1 V

The nominal supply voltage ensures stable performance and power efficiency.

No. of DMA Channels: 72

The high number of DMA channels enables efficient data transfer for complex processing tasks.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting and space-saving on the circuit board.

Format: FLOATING POINT

The floating-point format is ideal for complex mathematical calculations and signal processing tasks.

Moisture Sensitivity Level (MSL): 4

The MSL level 4 indicates a moderate moisture sensitivity, suitable for standard manufacturing processes.

Low Power Mode: YES

The low power mode option helps in conserving energy and extending the battery life of devices equipped with this DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8168CCYG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8168CCYG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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