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DSPIC30F2010-20E/SO

Microchip Technology

DSPIC30F2010-20E/SO by Microchip Technology

DSPIC30F2010-20E/SO by Microchip Technology is a 16-bit DSP with 5.5V max supply voltage, 40MHz clock frequency, and 512 RAM bytes. Ideal for automotive applications, it features 6-Ch ADCs, PWM channels, and connectivity options like I2C and SPI for versatile digital signal processing tasks.

Median Price

$5.340

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,458 parts In-Stock

1+ parts

$5.340

100+ parts

$4.400

1k+ parts

$4.030

10k+ parts

$3.840

1,458

$5.340

$4.400

$4.030

$3.840

DigiKey

USA . 85 parts In-Stock

1+ parts

$5.340

100+ parts

$4.675

1k+ parts

-

10k+ parts

-

85

$5.340

$4.675

-

-

Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$5.340

100+ parts

$4.850

1k+ parts

$4.790

10k+ parts

-

50

$5.340

$4.850

$4.790

-

Verical

USA . 1 parts In-Stock

1+ parts

$10.686

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$10.686

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.277

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$5.277

-

-

-

NAC Semi

USA . 1,215 parts In-Stock

1+ parts

$5.500

100+ parts

$4.990

1k+ parts

$4.560

10k+ parts

-

1,215

$5.500

$4.990

$4.560

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Vyrian

USA . 2,369 parts In-Stock

1+ parts

-

100+ parts

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2,369

-

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-

Chip Stock

USA . 1,023 parts In-Stock

1+ parts

-

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1,023

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Greenchips

USA . 13 parts In-Stock

1+ parts

-

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13

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SIE Connect GmbH - GreenChips

Germany . 13 parts In-Stock

1+ parts

-

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,748 parts In-Stock

1+ parts

$3.960

100+ parts

-

1k+ parts

$3.801

10k+ parts

$3.801

3,748

$3.960

-

$3.801

$3.801

Semicontronic

India . 82 parts In-Stock

1+ parts

$4.540

100+ parts

$4.426

1k+ parts

$4.404

10k+ parts

-

82

$4.540

$4.426

$4.404

-

Continental Prestige Electronics

USA . 5,332 parts In-Stock

1+ parts

$5.148

100+ parts

-

1k+ parts

-

10k+ parts

$5.045

5,332

$5.148

-

-

$5.045

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.277

100+ parts

-

1k+ parts

$5.013

10k+ parts

$4.908

2,000

$5.277

-

$5.013

$4.908

AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$8.302

100+ parts

-

1k+ parts

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10k+ parts

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642

$8.302

-

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Ampacity Inc.

Singapore . 92 parts In-Stock

1+ parts

$9.880

100+ parts

-

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10k+ parts

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92

$9.880

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$19.454

100+ parts

$18.481

1k+ parts

$18.481

10k+ parts

-

2,500

$19.454

$18.481

$18.481

-

Aztec Data Supply Inc.

USA . 1,716 parts In-Stock

1+ parts

$45.020

100+ parts

-

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10k+ parts

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1,716

$45.020

-

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Corohmni

South Africa . 172 parts In-Stock

1+ parts

$50.155

100+ parts

-

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172

$50.155

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LOOK Integrated Logistics

Peru . 7,697 parts In-Stock

1+ parts

-

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7,697

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Argo Parts USA

USA . 4,210 parts In-Stock

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4,210

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NIA Electronics

USA . 3,371 parts In-Stock

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3,371

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Ledger Components

France . 3,371 parts In-Stock

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3,371

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Lixinc

USA . 2,647 parts In-Stock

1+ parts

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2,647

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Montano Global Distributors

Canada . 2,290 parts In-Stock

1+ parts

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2,290

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LMD Electronica

Estonia . 1,743 parts In-Stock

1+ parts

-

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1,743

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Infinite Electronics LLP (Excess)

. 1,025 parts In-Stock

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1,025

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Kepictronics

USA . 443 parts In-Stock

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443

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Perfect Parts

USA . 149 parts In-Stock

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149

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Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC30F2010-20E/SO Digital Signal Processor. Crafted with precision and expertise, this product offers unrivaled performance in a wide range of applications. From automotive to industrial automation, this DSP provides seamless connectivity and low power consumption, ensuring optimal efficiency. Experience the reliability and innovation that only Microchip Technology can deliver, and take your projects to new heights with the DSPIC30F2010-20E/SO.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy assembly and space-saving design.

Maximum Supply Voltage:

5.5 V - Supports a wide range of power sources.

On Chip Data RAM Width:

8 - Enhances data processing capabilities.

Screening Level:

TS 16949 - Ensures high quality and reliability.

Package Shape:

RECTANGULAR - Facilitates efficient PCB layout.

Bit Size:

16 - Offers a balance between speed and precision.

Power Supplies (V):

3/5 - Provides flexibility in power options.

No. of Terminals:

28 - Enables versatile connectivity options.

Package Style (Meter):

SMALL OUTLINE - Ideal for space-constrained applications.

Minimum Supply Voltage:

3 V - Compatible with a wide range of power sources.

Maximum Operating Temperature:

125 °C - Suitable for rugged environments.

No. of External Interrupts:

3 - Allows for timely response to external events.

Minimum Operating Temperature:

40 °C - Suitable for extreme temperature conditions.

Terminal Finish:

Matte Tin (Sn) - Ensures reliable electrical connections.

ADC Channels:

YES - Enables analog-to-digital conversion for sensor integration.

Terminal Position:

DUAL - Enhances stability and durability of connections.

ROM Words:

4096 - Offers ample storage for program instructions.

Maximum Seated Height:

2.65 mm - Enables compact device design.

RAM Words:

512 - Supports efficient data processing and storage.

Width:

7.5 mm - Allows for compact device dimensions.

Data EEPROM Size:

1K - Provides additional non-volatile storage.

Peripherals:

BOD, POR, PWM(8), QEI, TIMER(3), WDT - Enhances functionality and versatility.

Maximum Clock Frequency:

40 MHz - Supports high-speed operation.

Maximum Time At Peak Reflow Temperature (s):

40 - Ensures reliable soldering during assembly.

Peak Reflow Temperature °C:

250 - Allows for robust solder joint formation.

Internal Bus Architecture:

MULTIPLE - Supports efficient data transfer within the chip.

Length:

17.9 mm - Suitable for various device form factors.

Temperature Grade:

AUTOMOTIVE - Ideal for automotive applications.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - Offers diverse functionalities for different applications.

No. of Timers:

5 - Enables precise timing control.

RAM Bytes:

512 - Provides ample memory for data storage.

Technology:

CMOS - Offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - Ensures secure and reliable connections.

Analog To Digital Convertors:

6-Ch 10-Bit - Enables multiple input channels for analog signal conversion.

Maximum Supply Current:

150 mA - Supports power-efficient operation.

Nominal Supply Voltage:

5 V - Standard voltage level for compatibility with most systems.

No. of Serial I/Os:

2 - Allows for communication with external devices.

PWM Channels:

YES - Enables precise control of pulse-width modulation signals.

Connectivity:

I2C, SPI, UART - Supports various communication protocols for device integration.

ROM Programmability:

FLASH - Allows for easy updates and modifications to firmware.

Terminal Pitch:

1.27 mm - Facilitates easy PCB layout and soldering.

Format:

FIXED POINT - Ensures predictable and consistent numerical representation.

Speed:

20 rpm - Suitable for applications requiring precise rotational speed control.

Low Power Mode:

YES - Helps conserve energy during idle periods.

Barrel Shifter:

YES - Enables efficient data manipulation operations.

On Chip Program ROM Width:

24 - Provides additional storage for program code.

No. of I/O Lines:

20 - Enables versatile input/output configurations.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F2010-20E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

512

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

20 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, PWM(8), QEI, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

DSPIC30F2010-20E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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