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ADSP-TS201SYBP-050

Analog Devices

ADSP-TS201SYBP-050 by Analog Devices

ADSP-TS201SYBP-050 by Analog Devices is a 32-bit DSP with a max clock frequency of 125 MHz. It features a 64-bit external data bus width and operates at temperatures ranging from -40 to 105 °C. Ideal for industrial applications requiring high-speed signal processing in compact form factors.

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Vyrian

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Semicontronic

India . 603 parts In-Stock

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AZTECH Wire

Italy . 797 parts In-Stock

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Ampacity Inc.

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One Stop Electronics

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Corohmni

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Parana Technologies

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IDEA Electronic Components Group

UK . 1,516 parts In-Stock

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DigiPath Technology Company

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Vigor

Singapore . 5,285 parts In-Stock

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Lucentia Tech

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Overview

Unleash the power of cutting-edge technology with the ADSP-TS201SYBP-050 by Analog Devices. As a leader in digital signal processors (DSPs), Analog Devices delivers quality and innovation in every product. This versatile DSP is perfect for a wide range of applications, providing unmatched performance and reliability. With a focus on value and customer satisfaction, this product offers incredible benefits and advantages to meet your technological needs. Upgrade your projects with the ADSP-TS201SYBP-050 and experience the difference that Analog Devices brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material allows for a lightweight and durable package, making the DSP easy to handle and transport.

Surface Mount: YES

The surface mount option simplifies the assembly process, saving time and effort when integrating the DSP into a system.

Maximum Supply Voltage: 1.1 V

With a low maximum supply voltage, this DSP is energy-efficient and helps reduce power consumption in electronic devices.

Address Bus Width: 32

The 32-bit address bus width provides ample memory addressing capabilities, allowing for efficient data processing and storage.

Package Shape: SQUARE

The square package shape makes it easy to fit the DSP into tight spaces, maximizing efficiency in system design and layout.

Bit Size: 32

The 32-bit architecture enables high-speed processing and calculation, making the DSP suitable for complex signal processing tasks.

Power Supplies (V): 1.05,1.5,2.5

This DSP offers a variety of power supply options, making it versatile and compatible with different systems and voltage requirements.

No. of Terminals: 576

The large number of terminals provides connectivity flexibility and options, allowing for versatile integration with other components.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal performance and signal integrity, enhancing the overall reliability of the DSP.

Minimum Supply Voltage: 1 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and helps in reducing overall power consumption.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extremely cold environments, making the DSP versatile and robust.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and assembly, streamlining the integration of the DSP into electronic systems.

Maximum Seated Height: 3.1 mm

The low seated height allows for compact system designs, minimizing space requirements and enhancing overall system efficiency.

Width: 25 mm

The compact width makes the DSP easy to fit into compact systems without compromising on performance or functionality.

Boundary Scan: YES

The boundary scan feature enables easy testing and debugging of the DSP, simplifying the development and maintenance process.

External Data Bus Width: 64

The wide 64-bit external data bus width allows for high-speed data transfer and processing, enhancing the overall performance of the DSP.

Maximum Clock Frequency: 125 MHz

With a high maximum clock frequency, this DSP can handle high-speed signal processing tasks efficiently, making it ideal for real-time applications.

Peak Reflow Temperature °C: 225

The high peak reflow temperature ensures reliable soldering and assembly, enhancing the durability and longevity of the DSP.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and processing efficiency, improving overall performance and speed.

Length: 25 mm

The compact length of the DSP allows for flexible system integration and layout, enabling efficient use of space in electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making the DSP suitable for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type allows for seamless integration with various systems and devices, enhancing the overall functionality and performance of the DSP.

Technology: CMOS

The CMOS technology used in this DSP offers low power consumption, high speed, and reliable performance, making it suitable for a wide range of applications.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and assembly, ensuring a reliable connection and efficient integration of the DSP into electronic systems.

Nominal Supply Voltage: 1.05 V

With a low nominal supply voltage, this DSP offers energy efficiency and helps in reducing power consumption, making it cost-effective and eco-friendly.

Terminal Pitch: 1 mm

The narrow terminal pitch allows for compact and efficient PCB design, optimizing space utilization and system performance.

Format: FLOATING POINT

The floating-point format enables precise and accurate calculations, making the DSP suitable for applications that require high computational accuracy.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this DSP is resistant to moisture damage, ensuring long-term reliability and durability in humid environments.

Barrel Shifter: YES

The barrel shifter feature enhances data processing efficiency and flexibility, enabling the DSP to handle complex algorithms and computations with ease.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-TS201SYBP-050 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 2.5V SUPPLY

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

125 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B576

Length:

25 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

576

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA576,24X24,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

225

Power Supplies (V):

1.05,1.5,2.5

Qualification:

Not Qualified

Maximum Seated Height:

3.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Trade Compliance

ADSP-TS201SYBP-050 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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