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TMS320C6414TBCLZ6

Texas Instruments

TMS320C6414TBCLZ6 by Texas Instruments

TMS320C6414TBCLZ6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.18 MHz. Ideal for digital signal processing applications requiring low power mode and flash ROM programmability.

Median Price

$133.555

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 375 parts In-Stock

1+ parts

$95.765

100+ parts

$92.885

1k+ parts

$72.004

10k+ parts

-

375

$95.765

$92.885

$72.004

-

Rochester

USA . 20 parts In-Stock

1+ parts

$97.230

100+ parts

$91.400

1k+ parts

$82.650

10k+ parts

$82.650

20

$97.230

$91.400

$82.650

$82.650

Mouser Electronics

USA . 53 parts In-Stock

1+ parts

$169.880

100+ parts

$132.930

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-

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53

$169.880

$132.930

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DigiKey

USA . 60 parts In-Stock

1+ parts

$169.890

100+ parts

$133.171

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-

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60

$169.890

$133.171

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,418 parts In-Stock

1+ parts

$90.977

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4,418

$90.977

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Nova Conductors

Japan . 55 parts In-Stock

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$101.050

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55

$101.050

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Vyrian

USA . 6,445 parts In-Stock

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-

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6,445

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Bristol Electronics

USA . 53 parts In-Stock

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53

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Prism Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$13.626

100+ parts

-

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817

$13.626

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Parana Technologies

USA . 936 parts In-Stock

1+ parts

$75.192

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936

$75.192

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Ampacity Inc.

Singapore . 114 parts In-Stock

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$81.400

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114

$81.400

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Semicontronic

India . 114 parts In-Stock

1+ parts

$81.400

100+ parts

$79.365

1k+ parts

$78.958

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114

$81.400

$79.365

$78.958

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DigiPath Technology Company

USA . 115 parts In-Stock

1+ parts

$82.795

100+ parts

$76.172

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115

$82.795

$76.172

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ChromeModa Solutions

Germany . 6,567 parts In-Stock

1+ parts

$84.485

100+ parts

$69.278

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6,567

$84.485

$69.278

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IDEA Electronic Components Group

UK . 1,454 parts In-Stock

1+ parts

$84.485

100+ parts

$80.261

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$76.036

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1,454

$84.485

$80.261

$76.036

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Corphita

USA . 899 parts In-Stock

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$86.188

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899

$86.188

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Corohmni

South Africa . 2,218 parts In-Stock

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$97.260

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2,218

$97.260

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Continental Prestige Electronics

USA . 3,912 parts In-Stock

1+ parts

$101.050

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$99.029

3,912

$101.050

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$99.029

Argo Parts USA

USA . 3,529 parts In-Stock

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3,529

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iodParts Technologies Inc.

India . 2,095 parts In-Stock

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2,095

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Perfect Parts

USA . 877 parts In-Stock

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877

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Netroflash

USA . 500 parts In-Stock

1+ parts

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$99.029

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$95.998

10k+ parts

$93.977

500

-

$99.029

$95.998

$93.977

Overview

Unlock the power of cutting-edge technology with the TMS320C6414TBCLZ6 by Texas Instruments. As a leading manufacturer in the field of Digital Signal Processors, this product offers unparalleled quality and reliability. Perfect for applications requiring high-speed processing and advanced functionality, this DSP provides seamless integration, low power consumption, and superior performance. Experience the benefits of fast data processing, efficient power management, and versatile connectivity options. Elevate your projects to new heights with the TMS320C6414TBCLZ6 and stay ahead of the curve in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and cost-effective, ensuring the safety of the internal components.

Integrated Cache: YES

Having an integrated cache helps in improving speed and efficiency of the DSP operations by reducing memory access times.

Maximum Supply Voltage: 1.16 V

The maximum supply voltage of 1.16V ensures stability and safe operation of the DSP within the specified voltage range.

Address Bus Width: 23

A wider address bus width of 23 allows for better memory addressing capabilities, enabling the DSP to handle larger datasets efficiently.

Bit Size: 32

A 32-bit architecture provides enhanced computational capabilities and allows for faster processing of digital signals.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) offers flexibility in system design and power optimization based on application requirements.

No. of Terminals: 532

Having a high number of terminals provides ample connectivity options for interfacing with external components and peripherals.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in colder environments.

RAM Words: 16384

A large amount of RAM allows for extensive data storage and manipulation, essential for complex signal processing tasks.

Width: 23 mm

Compact form factor with a width of 23mm enables space-efficient integration of the DSP in various electronic devices.

Maximum Clock Frequency: 75.18 MHz

High maximum clock frequency of 75.18 MHz enables fast execution of instructions and real-time signal processing.

ROM Programmability: FLASH

Having flash-programmable ROM allows for easy updates and modifications to the program code without requiring additional hardware.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBCLZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TBCLZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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