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DSPIC33EV256GM106T-I/PTVAO

Microchip Technology

DSPIC33EV256GM106T-I/PTVAO by Microchip Technology

DSPIC33EV256GM106T-I/PTVAO by Microchip Technology is a 16-bit digital signal processor with 32768 RAM words and 40 MHz clock frequency. It is ideal for industrial applications requiring high-speed processing, featuring 9 timers, 4 DMA channels, and low power mode for efficient operation.

Median Price

$6.210

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,200 parts In-Stock

1+ parts

$6.210

100+ parts

$5.150

1k+ parts

$4.740

10k+ parts

$4.520

1,200

$6.210

$5.150

$4.740

$4.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$4.450

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$4.450

-

-

-

Vyrian

USA . 304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

304

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$4.361

100+ parts

-

1k+ parts

$4.187

10k+ parts

-

500

$4.361

-

$4.187

-

Continental Prestige Electronics

USA . 4,009 parts In-Stock

1+ parts

$4.450

100+ parts

-

1k+ parts

-

10k+ parts

$4.361

4,009

$4.450

-

-

$4.361

Argo Parts USA

USA . 2 parts In-Stock

1+ parts

$4.450

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$4.450

-

-

-

AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$5.347

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$5.347

-

-

-

Semicontronic

India . 1,522 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

10k+ parts

-

1,522

$16.000

$15.600

$15.520

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$35.879

100+ parts

$34.085

1k+ parts

$34.085

10k+ parts

-

3,000

$35.879

$34.085

$34.085

-

Aztec Data Supply Inc.

USA . 880 parts In-Stock

1+ parts

$77.360

100+ parts

-

1k+ parts

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10k+ parts

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880

$77.360

-

-

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Corohmni

South Africa . 413 parts In-Stock

1+ parts

$81.038

100+ parts

-

1k+ parts

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10k+ parts

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413

$81.038

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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20,000

-

-

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NIA Electronics

USA . 7,336 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,336

-

-

-

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Ledger Components

France . 7,336 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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7,336

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-

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LMD Electronica

Estonia . 7,092 parts In-Stock

1+ parts

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7,092

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Lixinc

USA . 5,725 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,725

-

-

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Montano Global Distributors

Canada . 3,338 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,338

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

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LOOK Integrated Logistics

Peru . 2,898 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,898

-

-

-

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Overview

Unlock the power of next-level digital signal processing with the DSPIC33EV256GM106T-I/PTVAO by Microchip Technology. As a trusted manufacturer in the industry, Microchip delivers top-quality products that guarantee reliability and performance. This digital signal processor excels in a variety of applications, offering customers unparalleled value with its advanced features and cutting-edge technology. Revolutionize your projects with the DSPIC33EV256GM106T-I/PTVAO and experience the benefits of seamless integration, high-speed processing, and efficient operation. Elevate your designs and drive innovation with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 5.5 V

Ability to operate under higher voltage conditions, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Efficient data processing capabilities with a wide data RAM width.

Screening Level: AEC-Q100; TS 16949

High quality and reliability standards for automotive and industrial applications.

Package Shape: SQUARE

Compact and uniform shape for easy integration into circuit designs.

Bit Size: 16

High processing capacity with a 16-bit architecture.

No. of Terminals: 64

Sufficient connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Modern packaging style with thin profile and fine pitch for compact system design.

Minimum Supply Voltage: 4.5 V

Operational at low voltage levels for power efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

No. of External Interrupts: 3

Interrupt handling capabilities for real-time system responses.

Minimum Operating Temperature: -40 °C

Ability to withstand harsh environmental conditions at low temperatures.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for long-term reliability.

Terminal Position: QUAD

Quad terminal position for stable electrical connections.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

RAM Words: 32768

Sufficient memory capacity for data storage and processing.

Width: 10 mm

Compact width for easy integration into system designs.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast data processing and response times.

Length: 10 mm

Compact length for space-efficient PCB layouts.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements for reliable operation in various conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile functionality as both a DSP and a controller for diverse applications.

No. of Timers: 9

Multiple timer options for scheduling tasks and events.

Technology: CMOS

Low power consumption and high noise immunity with CMOS technology.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder connections.

Maximum Supply Current: 60 mA

Low supply current operation for power efficiency.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

No. of DMA Channels: 4

Direct Memory Access (DMA) support for efficient data transfers.

ROM Programmability: FLASH

Programmable ROM with FLASH technology for easy firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB designs.

Format: FIXED POINT

Fixed-point arithmetic for efficient numerical processing.

Low Power Mode: YES

Energy-efficient low power mode for extended battery life.

On Chip Program ROM Width: 8

Programmable ROM width of 8 bits for flexible firmware storage.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV256GM106T-I/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

A/D CONVERTERS IS ALSO AVAILABLE IN 36-CH 10-BIT, OPERATES UPTO 70MIPS

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSPIC33EV256GM106T-I/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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