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DSPIC33EP256MU814T-I/PL

Microchip Technology

DSPIC33EP256MU814T-I/PL by Microchip Technology

DSPIC33EP256MU814T-I/PL by Microchip is a 16-bit DSP with 28672 RAM words, operating at up to 60 MHz. Ideal for industrial applications, it features 9 timers, 15 DMA channels, and low power mode support. With a package style of flatpack and fine pitch, this CMOS technology-based processor offers high performance in a compact form factor.

Median Price

$10.630

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$10.630

100+ parts

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1,000

$10.630

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Vyrian

USA . 7,847 parts In-Stock

1+ parts

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7,847

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 232 parts In-Stock

1+ parts

$3.000

100+ parts

-

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232

$3.000

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Continental Prestige Electronics

USA . 6,600 parts In-Stock

1+ parts

$10.630

100+ parts

-

1k+ parts

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10k+ parts

$10.417

6,600

$10.630

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-

$10.417

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$10.630

100+ parts

$10.417

1k+ parts

-

10k+ parts

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2,000

$10.630

$10.417

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$15.212

100+ parts

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744

$15.212

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Argo Parts USA

USA . 4,481 parts In-Stock

1+ parts

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4,481

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RGB Technical Solutions

Ukraine . 1,818 parts In-Stock

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1,818

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EP256MU814T-I/PL from Microchip Technology. As a leading manufacturer in the industry, this Digital Signal Processor offers unparalleled performance and reliability for a wide range of applications. With its innovative features and high-quality design, this product provides customers with exceptional value and benefits. Experience seamless operation and enhanced efficiency with the DSPIC33EP256MU814T-I/PL, making it the perfect choice for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for package body material helps in reducing the overall weight of the product while maintaining durability.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

RAM Words: 28672

The large RAM capacity allows for efficient data processing and storage, making the product suitable for complex applications.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency enables fast and efficient signal processing, making the product ideal for real-time applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, leading to improved performance and reliability.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU814T-I/PL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

144

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

DSPIC33EP256MU814T-I/PL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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