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TMS320F28335ZAYA

Texas Instruments

TMS320F28335ZAYA by Texas Instruments

TMS320F28335ZAYA by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 8 external interrupts, and 3 timers. Ideal for industrial applications requiring high-speed processing, it features 179 terminals in a low-profile package with a max seated height of 1.4 mm. The processor's CMOS technology and floating-point format make it suitable for digital signal processing tasks.

Median Price

$44.720

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,213 parts In-Stock

1+ parts

$29.722

100+ parts

$25.962

1k+ parts

$17.905

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-

4,213

$29.722

$25.962

$17.905

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Mouser Electronics

USA . 465 parts In-Stock

1+ parts

$44.720

100+ parts

$31.770

1k+ parts

$31.760

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-

465

$44.720

$31.770

$31.760

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DigiKey

USA . 87 parts In-Stock

1+ parts

$44.750

100+ parts

$34.582

1k+ parts

$31.043

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-

87

$44.750

$34.582

$31.043

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,705 parts In-Stock

1+ parts

$28.236

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-

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4,705

$28.236

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Nova Conductors

Japan . 10 parts In-Stock

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$31.140

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10

$31.140

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Vyrian

USA . 1,849 parts In-Stock

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1,849

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Chip Stock

USA . 131 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$18.347

100+ parts

$17.430

1k+ parts

$17.430

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2,500

$18.347

$17.430

$17.430

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Corohmni

South Africa . 3,206 parts In-Stock

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$23.495

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$23.495

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Semicontronic

India . 2,067 parts In-Stock

1+ parts

$25.260

100+ parts

$24.628

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$24.502

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2,067

$25.260

$24.628

$24.502

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Ampacity Inc.

Singapore . 1,745 parts In-Stock

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$25.260

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$25.260

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Corphita

USA . 1,905 parts In-Stock

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$26.750

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$26.750

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Continental Prestige Electronics

USA . 1,899 parts In-Stock

1+ parts

$31.140

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$30.517

1,899

$31.140

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$30.517

Netroflash

USA . 100 parts In-Stock

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$31.140

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100

$31.140

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Parana Technologies

USA . 1,463 parts In-Stock

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$36.347

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1,463

$36.347

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DigiPath Technology Company

USA . 496 parts In-Stock

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$40.022

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496

$40.022

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ChromeModa Solutions

Germany . 4,001 parts In-Stock

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$40.839

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$33.488

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4,001

$40.839

$33.488

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IDEA Electronic Components Group

UK . 2,297 parts In-Stock

1+ parts

$40.839

100+ parts

$38.797

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$36.755

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2,297

$40.839

$38.797

$36.755

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Microchip USA

USA . 8,736 parts In-Stock

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$65.726

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iodParts Technologies Inc.

India . 25,000 parts In-Stock

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Lixinc

USA . 13,585 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 800 parts In-Stock

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Futuretech Components

Singapore . 320 parts In-Stock

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Argo Parts USA

USA . 225 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320F28335ZAYA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality products that guarantee reliability and performance. This DSP is perfect for a wide range of applications, offering customers seamless integration and optimal efficiency. Experience the value and benefits of advanced technology with the TMS320F28335ZAYA, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ensures the product is easy to handle and long-lasting.

Maximum Supply Voltage: 1.995 V

Allows for efficient power usage and prevents damage from voltage spikes.

On Chip Data RAM Width: 16

Wide data RAM allows for quick access to information, improving processing speeds.

Bit Size: 32

Higher bit size provides better data processing capability and accuracy.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile product that can be used for different types of digital signal processing tasks.

Maximum Clock Frequency: 150 MHz

High clock frequency enables fast signal processing and response times.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers efficient and low-power operation.

Moisture Sensitivity Level (MSL): 3

With MSL 3, the product can withstand moderate exposure to moisture during handling and assembly.

Low Power Mode: YES

Energy-efficient low power mode helps in reducing power consumption and heat generation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28335ZAYA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

179

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

69632

RAM Words:

34816

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

.315 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TMS320F28335ZAYA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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