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ADSP-21479BSWZ-2AX

Analog Devices

ADSP-21479BSWZ-2AX by Analog Devices

ADSP-21479BSWZ-2AX by Analog Devices is a 32-bit DSP with 163840 RAM words. Operating at -40 to 85°C, it has power supplies of 1.2V and 3.3V. Ideal for industrial applications, this DSP comes in a square flatpack package with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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VNN

France . 5,508 parts In-Stock

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Vyrian

USA . 2,469 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Digiode

USA . 55 parts In-Stock

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One Stop Electronics

USA . 1,365 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 310 parts In-Stock

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$8.946

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Semicontronic

India . 367 parts In-Stock

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$24.000

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$23.400

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$23.280

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$23.280

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Ampacity Inc.

Singapore . 186 parts In-Stock

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$30.000

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Aztec Data Supply Inc.

USA . 297 parts In-Stock

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$31.270

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Corohmni

South Africa . 994 parts In-Stock

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$48.235

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Parana Technologies

USA . 1,927 parts In-Stock

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$70.057

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$65.153

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IDEA Electronic Components Group

UK . 2,318 parts In-Stock

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$75.330

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$71.564

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DigiPath Technology Company

USA . 1,028 parts In-Stock

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$117.515

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$112.814

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Continental Prestige Electronics

USA . 4,331 parts In-Stock

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Argo Parts USA

USA . 4,283 parts In-Stock

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Corphita

USA . 309 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the ADSP-21479BSWZ-2AX by Analog Devices. Known for their superior quality and cutting-edge technology, Analog Devices delivers unmatched performance in the realm of DSPs. Whether you're working on audio processing, telecommunications, or control systems, this product offers unparalleled value with its 32-bit bit size, industrial-grade temperature range, and extensive RAM words capacity. Say goodbye to limitations and hello to endless possibilities with the ADSP-21479BSWZ-2AX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the DSP, making it suitable for a variety of industrial applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving, making the DSP convenient for use in compact designs.

Package Shape: SQUARE

Square package shape helps in efficient layout and mounting of the DSP on circuit boards, optimizing space utilization.

Bit Size: 32

32-bit architecture enables the DSP to handle complex signal processing tasks with high precision and accuracy.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for versatile compatibility with different systems and configurations.

No. of Terminals: 100

With a high number of terminals, the DSP can interface with various external components and peripherals, enhancing its connectivity and functionality.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact and space-efficient design, making the DSP suitable for applications where size constraints are critical.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the DSP to function effectively in cold conditions, making it versatile for a wide range of applications.

Terminal Position: QUAD

Quad terminal position provides stable connections and secure mounting, ensuring the DSP's reliability in various operating conditions.

RAM Words: 163840

Large RAM capacity allows the DSP to efficiently store and process a significant amount of data, enabling fast and accurate signal processing.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating indicates the DSP's robustness and reliability for use in harsh industrial environments with extreme temperature fluctuations.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and secure connections, enhancing the DSP's reliability and longevity in operation.

Terminal Pitch: 0.5 mm

With a small terminal pitch, the DSP facilitates high-density mounting on circuit boards, making it suitable for compact and complex electronic systems.

Format: FLOATING POINT

Floating-point format allows for precise calculations and accurate processing of digital signals, making the DSP ideal for applications requiring high computational accuracy.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21479BSWZ-2AX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Bit Size:

32

Format:

FLOATING POINT

JESD-30 Code:

S-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

163840

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

ADSP-21479BSWZ-2AX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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