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DSPIC33CH512MP508-E/PTVAO

Microchip Technology

DSPIC33CH512MP508-E/PTVAO by Microchip Technology

DSPIC33CH512MP508-E/PTVAO by Microchip Technology is a 16-bit digital signal processor with 64 MHz clock frequency, suitable for automotive applications. It features 49152 RAM words, 8 DMA channels, and operates at temperatures ranging from -40 to 125°C. Ideal for high-performance embedded systems requiring low power consumption.

Median Price

$4.310

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 357 parts In-Stock

1+ parts

$4.310

100+ parts

$3.560

1k+ parts

$3.260

10k+ parts

$3.110

357

$4.310

$3.560

$3.260

$3.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,251

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-

-

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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600

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 234 parts In-Stock

1+ parts

$3.660

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$3.660

-

-

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Semicontronic

India . 32 parts In-Stock

1+ parts

$7.970

100+ parts

$7.771

1k+ parts

$7.731

10k+ parts

-

32

$7.970

$7.771

$7.731

-

AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$18.640

100+ parts

-

1k+ parts

-

10k+ parts

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371

$18.640

-

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Corohmni

South Africa . 79 parts In-Stock

1+ parts

$32.696

100+ parts

-

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10k+ parts

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79

$32.696

-

-

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Aztec Data Supply Inc.

USA . 3,188 parts In-Stock

1+ parts

$54.820

100+ parts

-

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3,188

$54.820

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-

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RGB Technical Solutions

Ukraine . 2,623 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,623

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Argo Parts USA

USA . 1,844 parts In-Stock

1+ parts

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1,844

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Continental Prestige Electronics

USA . 1,642 parts In-Stock

1+ parts

-

100+ parts

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1,642

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-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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450

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Overview

Unlock the power of cutting-edge technology with the DSPIC33CH512MP508-E/PTVAO by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality Digital Signal Processors that are perfect for a wide range of applications. With advanced features and reliable performance, this product offers customers unparalleled value and benefits. Experience seamless operation, high efficiency, and superior functionality with the DSPIC33CH512MP508-E/PTVAO - the ultimate choice for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use in various environments.

Surface Mount: YES

Enables easy and efficient mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Can operate within a wide range of supply voltages, ensuring compatibility with different power sources.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage capabilities.

Screening Level: AEC-Q100

Compliance with automotive industry standards ensures high reliability and performance in automotive applications.

Package Shape: SQUARE

Square package shape enables compact integration into systems with limited space constraints.

Bit Size: 16

16-bit architecture offers higher processing capabilities and precision in digital signal processing tasks.

No. of Terminals: 80

Ample number of terminals provide connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Flatpack design with thin profile and fine pitch enhances thermal performance, signal integrity, and ease of PCB layout.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages without compromising performance, ideal for power-constrained applications.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable performance in harsh environmental conditions.

No. of External Interrupts: 3

External interrupt support enables real-time responses to external events, enhancing system responsiveness.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold environments, suitable for various applications.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connectivity during assembly processes.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact and slim design integration, especially beneficial in space-constrained applications.

RAM Words: 49152

Large RAM capacity allows for efficient data handling and processing tasks, suitable for complex signal processing algorithms.

Width: 12 mm

Compact width dimension enables space-efficient placement on PCBs, optimizing board layout and design.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during manufacturing and maintenance phases.

Maximum Clock Frequency: 64 MHz

High maximum clock frequency allows for faster data processing and real-time operation in demanding applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and system performance, supporting multitasking operations efficiently.

Length: 12 mm

Compact length dimension facilitates space-saving integration in compact electronic systems.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable performance in automotive applications subjected to varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processing capabilities coupled with additional peripheral functions enhance the versatility and efficiency of the product.

No. of Timers: 6

Multiple timers provide precise timing control for signal processing and synchronization tasks, enhancing system functionality.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for energy-efficient and fast processing performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates surface mounting on PCBs, ensuring secure and reliable solder connections.

Maximum Supply Current: 98 mA

Low maximum supply current consumption allows for energy-efficient operation and prolonged battery life in portable applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable performance in various operating conditions.

No. of DMA Channels: 8

Multiple DMA channels enable efficient data transfer and processing tasks, enhancing system performance and responsiveness.

No. of Serial I/Os: 2

Serial I/O interfaces offer versatile connectivity options for external communication and data exchange with peripheral devices.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and on-the-fly firmware updates and customization, enhancing product versatility and adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates precise and compact soldering connections, ensuring secure electrical connections and reliable performance.

Format: FIXED POINT

Fixed-point format offers deterministic and stable numerical processing, ideal for signal processing algorithms requiring precise calculations.

Low Power Mode: YES

Low power mode capability enables energy-efficient operation and extended battery life, suitable for portable and battery-powered applications.

Barrel Shifter: YES

Barrel shifter feature enhances data manipulation capabilities, enabling efficient and fast shifting operations in digital signal processing tasks.

On Chip Program ROM Width: 24

Wide on-chip program ROM width accommodates complex program storage and execution, supporting advanced signal processing algorithms and functionalities.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CH512MP508-E/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

16kbytes slave core Ram available

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

49152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

98 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

DSPIC33CH512MP508-E/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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