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TMS320DM6435ZWT5CX

Texas Instruments

TMS320DM6435ZWT5CX by Texas Instruments

TMS320DM6435ZWT5CX by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at 1.14-1.26V. Ideal for digital signal processing applications, it features low power mode, boundary scan support, and a compact grid array package style.

Median Price

$30.656

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$30.656

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150

$30.656

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Vyrian

USA . 8,167 parts In-Stock

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Digiode

USA . 4,407 parts In-Stock

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4,407

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Distributors (Availability)

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One Stop Electronics

USA . 136 parts In-Stock

1+ parts

$9.000

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136

$9.000

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AZTECH Wire

Italy . 515 parts In-Stock

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$14.942

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515

$14.942

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Semicontronic

India . 847 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

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847

$27.000

$26.325

$26.190

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Continental Prestige Electronics

USA . 4,960 parts In-Stock

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$30.656

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$30.043

4,960

$30.656

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$30.043

Netroflash

USA . 50 parts In-Stock

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$30.656

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$30.043

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50

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$30.043

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Ampacity Inc.

Singapore . 1,004 parts In-Stock

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$31.000

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$31.000

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Parana Technologies

USA . 1,886 parts In-Stock

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$50.142

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DigiPath Technology Company

USA . 594 parts In-Stock

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$55.212

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ChromeModa Solutions

Germany . 3,766 parts In-Stock

1+ parts

$56.339

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$46.198

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3,766

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IDEA Electronic Components Group

UK . 244 parts In-Stock

1+ parts

$56.339

100+ parts

$53.522

1k+ parts

$50.705

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244

$56.339

$53.522

$50.705

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Corohmni

South Africa . 1,182 parts In-Stock

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$62.854

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QUARKTWIN TECHNOLOGY LTD

USA . 20,344 parts In-Stock

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Argo Parts USA

USA . 3,807 parts In-Stock

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Corphita

USA . 1,219 parts In-Stock

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Overview

Enhance your digital signal processing projects with the TMS320DM6435ZWT5CX by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable and efficient solutions for a wide range of applications in the DSP category. With its advanced technology and low power mode, this product provides exceptional value and benefits to customers looking to optimize their systems. Whether you're working on audio processing, telecommunications, or industrial automation, the TMS320DM6435ZWT5CX is the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage provides flexibility in power requirements for various applications.

Address Bus Width: 13

The wide address bus width enhances data processing capabilities and memory access efficiency.

Package Shape: SQUARE

The square package shape enables efficient utilization of space on a circuit board.

No. of Terminals: 361

With a high number of terminals, this product offers versatile connectivity options for peripherals and external devices.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with low profile and fine pitch design ensures stability and reliability in connectivity.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and improves heat dissipation.

Maximum Seated Height: 1.4 mm

The low maximum seated height saves space and allows for compact designs.

Width: 16 mm

The narrow width of 16 mm enables the product to fit in tight spaces and compact devices.

Boundary Scan: YES

The boundary scan feature facilitates testing and debugging during the manufacturing process.

External Data Bus Width: 32

The wide external data bus width enhances data processing speed and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature reduces the risk of damage during soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints and robust connections.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enables parallel processing and efficient data flow.

Length: 16 mm

The compact length of 16 mm allows for flexible placement and integration in various systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This product is a versatile digital signal processor suitable for a wide range of applications.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed processing capabilities.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable communication.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent performance and reliable operation.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting and compact PCB designs.

Format: FIXED POINT

The fixed-point format simplifies computational tasks and enhances accuracy in processing.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates that this product has moderate moisture sensitivity, suitable for most environments.

Low Power Mode: YES

The low power mode feature enhances energy efficiency and prolongs battery life for portable applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6435ZWT5CX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

EMIF ADDRESS BUS 22 AND DATA BUS 8 AVAILABLE

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6435ZWT5CX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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