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DSPIC33EP512MC506-H/MR

Microchip Technology

DSPIC33EP512MC506-H/MR by Microchip Technology

DSPIC33EP512MC506-H/MR by Microchip Technology is a 16-bit DSP with 60 MHz clock frequency, ideal for automotive applications. It features 49152 RAM words, 3.6V max supply voltage, and AEC-Q100 screening level. With 5 timers and 4 DMA channels, it offers high performance in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,136 parts In-Stock

1+ parts

-

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1k+ parts

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2,136

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

-

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-

1k+ parts

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 891 parts In-Stock

1+ parts

$11.134

100+ parts

-

1k+ parts

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891

$11.134

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Semicontronic

India . 145 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

10k+ parts

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145

$19.000

$18.525

$18.430

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Ampacity Inc.

Singapore . 1,504 parts In-Stock

1+ parts

$23.000

100+ parts

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1,504

$23.000

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$28.555

100+ parts

$27.127

1k+ parts

$27.127

10k+ parts

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2,000

$28.555

$27.127

$27.127

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Corohmni

South Africa . 756 parts In-Stock

1+ parts

$53.303

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756

$53.303

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Aztec Data Supply Inc.

USA . 2,520 parts In-Stock

1+ parts

$58.600

100+ parts

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2,520

$58.600

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Argo Parts USA

USA . 4,982 parts In-Stock

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4,982

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West Coast Incorporated

USA . 4,885 parts In-Stock

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4,885

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Continental Prestige Electronics

USA . 3,098 parts In-Stock

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3,098

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC33EP512MC506-H/MR digital signal processor. Crafted with precision and expertise, this high-quality product offers unparalleled performance in a compact package. From automotive to industrial applications, this DSP provides seamless integration and reliable operation. Experience the benefits of its advanced features, robust design, and efficient processing capabilities. Elevate your projects to new heights with the Microchip Technology DSPIC33EP512MC506-H/MR.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount

YES - Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage

3.6 V - Accommodates a wide range of power supply options, increasing flexibility in system design.

On Chip Data RAM Width

8 - Provides sufficient memory for processing data efficiently, enhancing the DSP's performance capabilities.

Screening Level

AEC-Q100; TS 16949 - Ensures high quality and reliability, making it ideal for automotive applications that demand stringent standards.

Package Shape

SQUARE - Offers a compact and space-saving design, suitable for applications where board real estate is limited.

Bit Size

16 - Enables precise and accurate processing of digital signals, delivering high performance in signal processing tasks.

No. of Terminals

64 - Provides ample I/O options for data transfer and connectivity, enhancing the DSP's versatility in system integration.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Ensures efficient heat dissipation and compact form factor, suitable for space-constrained applications.

Minimum Supply Voltage

3 V - Allows operation in low-power scenarios, increasing energy efficiency and extending battery life in portable devices.

Maximum Operating Temperature

150 °C - Provides the DSP with a wide operating temperature range, ensuring reliability in harsh environmental conditions.

No. of External Interrupts

3 - Facilitates timely response to external events, enhancing the DSP's real-time processing capabilities.

Minimum Operating Temperature

40 °C - Ensures reliable operation even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish

Matte Tin (Sn) - Provides corrosion resistance and solderability, ensuring long-term reliability in diverse operating conditions.

Terminal Position

QUAD - Simplifies PCB layout and assembly, optimizing space utilization and streamlining production processes.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512MC506-H/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

NO

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

49152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

DSPIC33EP512MC506-H/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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