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DSPIC33CK64MC105T-I/PTVAO

Microchip Technology

DSPIC33CK64MC105T-I/PTVAO by Microchip Technology

DSPIC33CK64MC105T-I/PTVAO by Microchip is a 16-bit DSP with 64 MHz clock frequency, 3.6V max supply voltage, and AEC-Q100 screening. Ideal for digital signal processing applications in automotive electronics due to its low power mode, flash ROM programmability, and multiple internal bus architecture.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 414 parts In-Stock

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414

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 550 parts In-Stock

1+ parts

$19.216

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550

$19.216

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Ampacity Inc.

Singapore . 1,372 parts In-Stock

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$26.000

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1,372

$26.000

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LMD Electronica

Estonia . 7,236 parts In-Stock

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Continental Prestige Electronics

USA . 6,624 parts In-Stock

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6,624

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NIA Electronics

USA . 1,414 parts In-Stock

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1,414

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Ledger Components

France . 1,414 parts In-Stock

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Argo Parts USA

USA . 1,235 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Montano Global Distributors

Canada . 450 parts In-Stock

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450

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LOOK Integrated Logistics

Peru . 41 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the DSPIC33CK64MC105T-I/PTVAO by Microchip Technology. As a leader in digital signal processors, Microchip Technology delivers cutting-edge solutions for a wide range of applications. This innovative product offers customers unmatched value and benefits, making it the ideal choice for your next project. Whether you're looking to optimize power efficiency or enhance processing speed, the DSPIC33CK64MC105T-I/PTVAO has you covered. Trust in Microchip Technology's expertise and elevate your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount capability makes it suitable for modern PCB designs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 3.6 V

Allows for operation in a wide range of power supply conditions, enhancing versatility.

On Chip Data RAM Width: 8

8-bit data RAM allows for efficient processing of digital signals with lower memory requirements.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape is space-efficient and provides easy integration into PCB layouts.

Bit Size: 16

16-bit architecture allows for processing and manipulation of data with higher precision and accuracy.

No. of Terminals: 48

Ample number of terminals provide connectivity options for peripherals and external components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This package style offers a compact form factor, enabling high-density mounting on PCBs.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions.

No. of External Interrupts: 4

Support for 4 external interrupts enables efficient handling of asynchronous events for better system responsiveness.

Minimum Operating Temperature: -40 °C

Wide temperature range support ensures reliable operation even in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection to external components.

Maximum Seated Height: 1.2 mm

Low profile design with maximum seated height of 1.2 mm enables slim and compact device construction.

RAM Words: 8192

Large RAM capacity of 8192 words allows for efficient data storage and processing in digital signal applications.

Width: 7 mm

Narrow width of 7 mm enables space-saving integration in compact device designs.

Boundary Scan: YES

Boundary scan feature simplifies testing and debugging of the product during manufacturing and maintenance.

Maximum Clock Frequency: 64 MHz

High maximum clock frequency of 64 MHz enables fast signal processing and real-time operation.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and facilitates efficient communication between components.

Length: 7 mm

Compact length of 7 mm enables efficient use of PCB space and integration into small form factor devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of digital signal processing and controller capabilities provides versatile functionality for a range of applications.

No. of Timers: 2

Built-in timers allow for precise timing control and event scheduling in digital signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and provides secure connection to the PCB.

Maximum Supply Current: 26 mA

Low maximum supply current requirement of 26 mA enhances energy efficiency and reduces operating costs.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures reliable and consistent performance.

No. of DMA Channels: 4

4 DMA channels enable efficient data transfer and management tasks, improving overall system performance.

No. of Serial I/Os: 3

Multiple serial I/O interfaces provide versatile communication options for connecting with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of the device's functionality.

Terminal Pitch: 0.5 mm

Compact terminal pitch of 0.5 mm enables high-density packaging and reduces PCB footprint.

Format: FIXED POINT

Fixed-point format simplifies arithmetic calculations and enhances computational efficiency in digital signal processing tasks.

Low Power Mode: YES

Low power mode functionality saves energy and extends battery life, making the product ideal for portable and battery-operated devices.

Barrel Shifter: YES

Presence of a barrel shifter facilitates efficient shifting and rotation operations on data, enhancing computational capabilities.

On Chip Program ROM Width: 8

8-bit width of on-chip program ROM allows for efficient storage and execution of program instructions.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK64MC105T-I/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DSPIC33CK64MC105T-I/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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