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MC56F8027MLH

NXP Semiconductors

MC56F8027MLH by NXP Semiconductors

MC56F8027MLH by NXP Semiconductors is a 16-bit DSP with 2048 RAM words, operating at up to 8 MHz. Ideal for automotive applications, it features low power mode, flash ROM programmability, and boundary scan capability.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

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$1.000

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15

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Digiode

USA . 2,741 parts In-Stock

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Vyrian

USA . 1,266 parts In-Stock

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Anansix

USA . 1,087 parts In-Stock

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1,087

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Distributors (Availability)

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Argo Parts USA

USA . 2,437 parts In-Stock

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$1.000

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2,437

$1.000

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Continental Prestige Electronics

USA . 2,042 parts In-Stock

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$1.000

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$0.980

2,042

$1.000

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$0.980

Netroflash

USA . 100 parts In-Stock

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$1.000

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100

$1.000

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Vigor

Singapore . 2,400 parts In-Stock

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$4.740

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2,400

$4.740

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Ampacity Inc.

Singapore . 606 parts In-Stock

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$12.000

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606

$12.000

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AZTECH Wire

Italy . 603 parts In-Stock

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$17.121

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603

$17.121

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One Stop Electronics

USA . 2,938 parts In-Stock

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$23.000

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Corohmni

South Africa . 2,105 parts In-Stock

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$70.956

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UNI Independent Distributors

Spain . 8,285 parts In-Stock

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Corphita

USA . 3,841 parts In-Stock

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Microchip USA

USA . 1,900 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MC56F8027MLH by NXP Semiconductors. As a leading manufacturer in the industry, NXP is known for delivering top-quality Digital Signal Processors that exceed expectations. Ideal for a wide range of applications, this DSP offers unparalleled value and benefits to customers. Whether you're looking for high performance, reliability, or efficiency, the MC56F8027MLH has got you covered. Experience seamless operation and superior results with this innovative product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product resistant to heat and moisture.

Surface Mount: YES

Surface mounting allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for increased performance capabilities and flexibility in power management.

RAM Words: 2048

Large RAM capacity enables efficient data processing and storage, enhancing overall performance.

Maximum Clock Frequency: 8 MHz

High clock frequency enables fast signal processing and execution of complex algorithms, making the product suitable for demanding applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in extreme temperature conditions, making the product ideal for automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionalities provides versatile processing capabilities for diverse applications, making the product a versatile solution.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, contributing to energy efficiency and compact design of the product.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization, enhancing product flexibility and adaptability to changing requirements.

Low Power Mode: YES

Low power mode extends battery life and reduces power consumption during idle periods, making the product energy-efficient and cost-effective.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8027MLH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

8 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

MC56F8027MLH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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