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DSPIC33EV128GM006-I/MR

Microchip Technology

DSPIC33EV128GM006-I/MR by Microchip Technology

DSPIC33EV128GM006-I/MR by Microchip Technology is a 16-bit DSP with 131072 ROM words, 8192 RAM words, and 36-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring high-speed processing up to 40 MHz, featuring low power mode and multiple peripherals like PWM(6) and TIMER(7).

Median Price

$3.374

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$3.374

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$3.374

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Vyrian

USA . 1,251 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,162 parts In-Stock

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$3.374

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$3.307

5,162

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Argo Parts USA

USA . 4,899 parts In-Stock

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$3.374

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4,899

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Netroflash

USA . 500 parts In-Stock

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$3.374

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$3.307

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AZTECH Wire

Italy . 367 parts In-Stock

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$7.863

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367

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Corohmni

South Africa . 1,920 parts In-Stock

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$74.053

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XL Components Corporation

Australia . 5,890 parts In-Stock

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5,890

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Marpe Global Electronics

Taiwan . 5,291 parts In-Stock

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QualityLine Systems

Poland . 1,525 parts In-Stock

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Microchip USA

USA . 1,341 parts In-Stock

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Overview

Enhance your digital signal processing capabilities with the DSPIC33EV128GM006-I/MR by Microchip Technology. Crafted with precision and expertise, this digital signal processor offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this product delivers superior quality and functionality. Experience seamless connectivity, advanced peripherals, and low power modes, all packed into a compact and efficient design. Elevate your projects to new heights with the DSPIC33EV128GM006-I/MR by Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Maximum Supply Voltage: 5.5 V

Allows for a wide input voltage range, making the product versatile and compatible with different power sources.

Bit Size: 16

With a larger bit size, the product can handle more complex processing tasks and provide higher accuracy.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables fast data processing and operation, making the product suitable for real-time applications.

Connectivity: I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

The wide range of connectivity options allows for seamless integration with other devices and systems, enhancing flexibility and compatibility.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and customization, making the product adaptable to changing requirements.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionality provides versatile processing capabilities suitable for a variety of applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV128GM006-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

36-Ch 12-Bit

Trade Compliance

DSPIC33EV128GM006-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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