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DSPIC30F3013-20E/SP

Microchip Technology

DSPIC30F3013-20E/SP by Microchip Technology

DSPIC30F3013-20E/SP by Microchip is a 16-bit DSP with max clock freq of 40MHz. It operates b/w -40 to 125 °C and has flash ROM programmability. Ideal for automotive applications, it features a rectangular package style with 28 terminals in-line at 2.54mm pitch.

Median Price

$5.993

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 33 parts In-Stock

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$5.993

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33

$5.993

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Vyrian

USA . 7,324 parts In-Stock

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7,324

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,041 parts In-Stock

1+ parts

$5.993

100+ parts

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$5.873

2,041

$5.993

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$5.873

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.993

100+ parts

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$5.693

10k+ parts

$5.573

500

$5.993

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$5.693

$5.573

AZTECH Wire

Italy . 567 parts In-Stock

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$10.952

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567

$10.952

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Semicontronic

India . 1,017 parts In-Stock

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$23.000

100+ parts

$22.425

1k+ parts

$22.310

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1,017

$23.000

$22.425

$22.310

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Ampacity Inc.

Singapore . 807 parts In-Stock

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$28.000

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807

$28.000

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RGB Technical Solutions

Ukraine . 8,232 parts In-Stock

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8,232

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Argo Parts USA

USA . 354 parts In-Stock

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Overview

Unlock the power of digital signal processing with the DSPIC30F3013-20E/SP by Microchip Technology. Crafted with precision and expertise, this versatile DSP offers unparalleled performance and reliability for a wide range of applications. From automotive systems to industrial automation, this DSP delivers exceptional value, efficiency, and innovation. Experience seamless operation and high-speed processing with the DSPIC30F3013-20E/SP, setting a new standard in digital signal processors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power supply options, accommodating a wider range of applications.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to fit the DSP into different electronic devices and circuit designs.

Bit Size: 16

A 16-bit architecture provides sufficient processing power for many signal processing applications.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies makes the DSP compatible with a variety of systems and integration scenarios.

No. of Terminals: 28

Sufficient number of terminals offer versatile connectivity options for interfacing with other components and peripherals.

Package Style (Meter): IN-LINE

In-line package style makes it easy to mount the DSP on PCBs and facilitates efficient routing of connections.

Minimum Supply Voltage: 4.5 V

Having a relatively low minimum supply voltage allows for operation in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliability and performance in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the DSP to function in extreme cold conditions without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides good solderability and conductivity for secure connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and routing, enabling efficient design and assembly.

Maximum Seated Height: 4.572 mm

Low seated height allows for compact designs and saves valuable space in electronic devices.

Width: 15.24 mm

Compact width dimensions make the DSP suitable for applications where space is constrained.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency enables fast signal processing and real-time operation in demanding applications.

Length: 34.671 mm

Moderate length dimensions offer a balance between compactness and functionality, suitable for various electronic designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures reliable performance in automotive applications where temperature variations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functions in a single IC provides versatility for a wide range of signal processing and control applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the performance of the DSP.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder and secure the DSP onto the PCB for stable connections.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage simplifies power management and ensures consistent performance under normal operating conditions.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates, enhancing the versatility and adaptability of the DSP.

Terminal Pitch: 2.54 mm

Standard terminal pitch simplifies PCB design and assembly, making it compatible with commonly used components and connectors.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and reduces computation complexity, making the DSP suitable for real-time signal processing tasks.

On Chip Program ROM Width: 24

Having a 24-bit width on-chip program ROM allows for storing larger program codes and data sets, enhancing the processing capabilities of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F3013-20E/SP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

34.671 mm

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

4.572 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

DSPIC30F3013-20E/SP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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