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DSPIC30F6015T-30I/PT

Microchip Technology

DSPIC30F6015T-30I/PT by Microchip Technology

DSPIC30F6015T-30I/PT by Microchip Technology is a 16-bit DSP with 40 MHz clock frequency, 8192 RAM words, and 24-bit on-chip program ROM. Ideal for industrial applications, it features low power mode, barrel shifter, and flash ROM programmability. With a package style of flatpack and thin profile, this digital signal processor has multiple internal bus architecture for enhanced performance.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,457 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 753 parts In-Stock

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$10.881

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Semicontronic

India . 848 parts In-Stock

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$19.000

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$18.525

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$18.430

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848

$19.000

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Ampacity Inc.

Singapore . 662 parts In-Stock

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$25.000

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

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$71.520

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300

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Advanced Electronics

New Zealand . 38 parts In-Stock

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$73.372

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$69.703

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$69.703

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$69.703

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Corohmni

South Africa . 659 parts In-Stock

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Lixinc

USA . 19,297 parts In-Stock

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XL Components Corporation

Australia . 6,734 parts In-Stock

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QualityLine Systems

Poland . 6,355 parts In-Stock

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Continental Prestige Electronics

USA . 5,710 parts In-Stock

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Marpe Global Electronics

Taiwan . 4,690 parts In-Stock

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Argo Parts USA

USA . 2,468 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 37 parts In-Stock

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Overview

Elevate your projects with the DSPIC30F6015T-30I/PT from Microchip Technology, a leading manufacturer in digital signal processors. This high-quality product offers unmatched performance and reliability in various applications, delivering value and benefits to customers seeking superior processing power. With its advanced features and innovative design, this DSP is sure to take your projects to the next level. Choose Microchip Technology for cutting-edge technology you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material makes the DSPs easy to handle and suitable for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, making the DSPs space-efficient.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, these DSPs can handle a wide range of power inputs for versatile use.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for efficient data processing and storage in the DSPs.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability in the manufacturing process of the DSPs.

Package Shape: SQUARE

The square package shape provides a compact footprint, ideal for densely packed circuit designs.

Bit Size: 16

The 16-bit size allows for high precision data processing capabilities in the DSPs.

Power Supplies (V): 3/5

The multiple power supply options give flexibility in powering the DSPs according to system requirements.

No. of Terminals: 64

With a high number of terminals, the DSPs can accommodate a wide range of connections for enhanced functionality.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers space-saving advantages and ease of assembly.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage requirement makes the DSPs energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in varying environmental conditions.

No. of External Interrupts: 5

The presence of external interrupts allows for efficient communication and event handling in the DSPs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables the DSPs to function in extreme cold environments effectively.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and improved solderability for reliable connections.

Terminal Position: QUAD

The quad terminal position allows for easy alignment and soldering during the assembly process.

Maximum Seated Height: 1.2 mm

The low maximum seated height profile makes the DSPs suitable for applications with height restrictions.

RAM Words: 8192

With a large number of RAM words, the DSPs can efficiently handle and process a significant amount of data.

Width: 10 mm

The compact width dimension makes the DSPs versatile for various board sizes and layouts.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency enables fast data processing and response times in the DSPs.

Maximum Time At Peak Reflow Temperature (s): 40

The extended time at peak reflow temperature allows for reliable soldering and assembly of the DSPs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures the solder joints are properly reflowed for secure connections.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances the data transfer speed and efficiency of the DSPs.

Length: 10 mm

The compact length dimension of the DSPs offers flexibility in fitting within limited space constraints.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance makes the DSPs suitable for rugged and demanding environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The combination of digital signal processing and controller capabilities in one device offers versatility in applications.

No. of Timers: 7

The presence of multiple timers allows for precise timing and scheduling functions in the DSPs.

Technology: CMOS

The CMOS technology used in the DSPs ensures low power consumption and high reliability in operation.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and robust connections during assembly.

Maximum Supply Current: 255 mA

The high maximum supply current rating ensures that the DSPs can handle power-intensive tasks efficiently.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V provides a stable power source for consistent performance of the DSPs.

No. of Serial I/Os: 5

The multiple serial I/Os allow for versatile connectivity options and data transfer capabilities in the DSPs.

ROM Programmability: FLASH

The flash ROM programmability feature enables flexibility in updating and reprogramming the DSPs.

Terminal Pitch: 0.5 mm

The small terminal pitch dimension allows for close spacing of terminals and compact design layout options.

Format: FIXED POINT

The fixed-point format provides precise and efficient data processing capabilities in the DSPs.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates the moisture resistance of the DSPs, making them suitable for various environments.

Low Power Mode: YES

The low power mode feature enhances energy efficiency and prolongs battery life in the DSPs.

Barrel Shifter: YES

The presence of a barrel shifter circuit enables efficient and fast data shifting operations in the DSPs.

On Chip Program ROM Width: 24

The wide on-chip program ROM width allows for storing a large amount of program code for efficient operation.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F6015T-30I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

5

No. of Serial I/Os:

5

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

255 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

DSPIC30F6015T-30I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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