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TMS320C6748EZWT3

Texas Instruments

TMS320C6748EZWT3 by Texas Instruments

TMS320C6748EZWT3 by Texas Instruments is a DSP with 16-bit external data bus width, 30 MHz max clock frequency, and operates at 1.05V. Ideal for digital signal processing applications due to its low power mode, fixed point format, and CMOS technology.

Median Price

$25.890

Lifecycle Status

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9

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1k+

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Texas Instruments

USA . 2,152 parts In-Stock

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$15.704

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$13.717

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$9.460

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DigiKey

USA . 206 parts In-Stock

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$25.890

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$18.265

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$17.077

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$25.890

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Mouser Electronics

USA . 84 parts In-Stock

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$25.890

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$17.730

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$17.460

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$25.890

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Digiode

USA . 3,236 parts In-Stock

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$14.919

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Nova Conductors

Japan . 50 parts In-Stock

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Chip Stock

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Vyrian

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LIBRA Elektronik GmbH

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Cyclops Electronics Ltd

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Ampacity Inc.

Singapore . 762 parts In-Stock

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$13.350

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Semicontronic

India . 633 parts In-Stock

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$13.350

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$13.016

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$12.950

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Corphita

USA . 3,853 parts In-Stock

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Corohmni

South Africa . 4,943 parts In-Stock

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Continental Prestige Electronics

USA . 3,970 parts In-Stock

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$16.460

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$16.131

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Parana Technologies

USA . 281 parts In-Stock

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$24.716

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$25.386

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DigiPath Technology Company

USA . 1,044 parts In-Stock

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$27.216

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ChromeModa Solutions

Germany . 2,047 parts In-Stock

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$27.771

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IDEA Electronic Components Group

UK . 1,873 parts In-Stock

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$26.382

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$24.994

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Lixinc

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A-Z Elektronik GmbH

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S.R.D Solutions

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Authorized Procurement Solutions

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Argo Parts USA

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Perfect Parts

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iodParts Technologies Inc.

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Netroflash

USA . 100 parts In-Stock

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$15.637

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$15.308

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Overview

Experience the power of cutting-edge technology with the TMS320C6748EZWT3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments ensures top-quality products for a wide range of applications. With a focus on performance and efficiency, this DSP offers unmatched value to customers looking to elevate their projects. Say goodbye to limitations and hello to endless possibilities with the TMS320C6748EZWT3 – your ultimate solution for all your processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the DSP.

Surface Mount: YES

The surface mount feature allows for easy and space-efficient installation of the DSP onto circuit boards.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05V ensures safe and efficient operation of the DSP within specified limits.

Address Bus Width: 14

The 14-bit address bus width allows for efficient data handling and processing capabilities of the DSP.

Package Shape: SQUARE

The square package shape offers a compact and uniform design for easy integration into electronic devices.

No. of Terminals: 361

The high number of terminals (361) provides ample connectivity options for interfacing with external components or peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for efficient heat dissipation and reliability during operation.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95V ensures compatibility with a wide range of power sources while maintaining optimal performance.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows for reliable operation in a variety of temperature settings.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to mount the DSP onto circuit boards and ensures a secure electrical connection.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm allows for a slim and compact overall design of the electronic device.

Width: 16 mm

The width of 16mm provides a balance between compactness and ease of integration into electronic systems.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the DSP during the manufacturing process.

External Data Bus Width: 16

The 16-bit external data bus width enables fast and efficient data transfer between the DSP and external peripherals.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency of 30MHz allows for fast and responsive data processing tasks within the DSP.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures effective soldering and electrical connections during assembly.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enables parallel processing and efficient data flow within the DSP for optimized performance.

Length: 16 mm

The length of 16mm provides a compact and uniform design for ease of integration into electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type allows for versatile connectivity and compatibility with a wide range of electronic systems and applications.

Technology: CMOS

The CMOS technology used in the DSP provides low power consumption, high speed, and reliability for efficient data processing tasks.

Terminal Form: BALL

The ball terminal form offers secure and reliable electrical connections for seamless integration into electronic circuits.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V ensures stable and reliable operation of the DSP with minimal power consumption.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm provides a balance between compactness and ease of soldering during the manufacturing process.

Format: FIXED POINT

The fixed-point format allows for efficient and precise numerical calculations within the DSP for accurate data processing tasks.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the level of protection required during storage and handling to prevent moisture-induced damage.

Low Power Mode: YES

The low power mode feature enables energy-efficient operation of the DSP, reducing power consumption and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6748EZWT3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6748EZWT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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