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DSPIC30F2010-30I/SOG

Microchip Technology

DSPIC30F2010-30I/SOG by Microchip Technology

DSPIC30F2010-30I/SOG by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 40 MHz. It features 512 bytes of RAM and 1K data EEPROM size, making it suitable for applications requiring high-speed processing and data storage. With connectivity options like I2C, SPI, and UART, it can be used in various industrial applications such as motor control systems and communication devices.

Median Price

$5.718

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

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$5.718

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Vyrian

USA . 7,735 parts In-Stock

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Sogenti Electronics

Canada . 44 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 2,944 parts In-Stock

1+ parts

$5.560

100+ parts

-

1k+ parts

$5.337

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$5.337

2,944

$5.560

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$5.337

$5.337

Continental Prestige Electronics

USA . 4,614 parts In-Stock

1+ parts

$5.718

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$5.603

4,614

$5.718

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$5.603

Netroflash

USA . 500 parts In-Stock

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$5.718

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$5.432

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$5.317

500

$5.718

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$5.432

$5.317

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$5.832

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$5.832

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$5.832

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900

$5.832

$5.832

$5.832

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AZTECH Wire

Italy . 872 parts In-Stock

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$6.474

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Ampacity Inc.

Singapore . 1,284 parts In-Stock

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$9.000

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Semicontronic

India . 1,408 parts In-Stock

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$11.000

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$10.725

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$10.670

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Corohmni

South Africa . 2,576 parts In-Stock

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$17.999

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Aztec Data Supply Inc.

USA . 182 parts In-Stock

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$80.620

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Microchip USA

USA . 7,926 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,271 parts In-Stock

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NIA Electronics

USA . 3,824 parts In-Stock

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Ledger Components

France . 3,824 parts In-Stock

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Montano Global Distributors

Canada . 3,301 parts In-Stock

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Argo Parts USA

USA . 2,066 parts In-Stock

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LMD Electronica

Estonia . 1,558 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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$2.565

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$2.565

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$2.565

900

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$2.565

$2.565

$2.565

Overview

Discover the power of the DSPIC30F2010-30I/SOG by Microchip Technology, a top-of-the-line Digital Signal Processor (DSP) that offers unparalleled quality and performance. With its advanced technology and precision engineering, Microchip Technology has established itself as a trusted leader in the industry. The DSPIC30F2010-30I/SOG is perfect for a wide range of applications, including industrial automation, consumer electronics, and telecommunications. Experience the value and benefits of this exceptional product, which features high-speed processing, low power consumption, and versatile connectivity options such as I2C, SPI, and UART. Don't settle for anything less than the best - choose the DSPIC30F2010-30I/SOG and revolutionize your digital signal processing capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into electronic circuits, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this DSP can handle higher voltage inputs, providing flexibility and compatibility with different power sources.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width enables efficient data storage and processing, ensuring smooth and fast operation of the DSP.

Screening Level: TS 16949

The TS 16949 screening level ensures that the DSP undergoes strict quality control processes, resulting in a reliable and high-performance product.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into circuit boards, making it suitable for space-constrained applications.

Bit Size: 16

The 16-bit architecture of this DSP allows for higher precision and accuracy in signal processing, making it ideal for applications that require complex calculations.

Power Supplies (V): 3/5

This DSP can operate with both 3V and 5V power supplies, providing flexibility in power source selection and compatibility with a wider range of devices.

No. of Terminals: 28

With 28 terminals, this DSP offers ample connectivity options, allowing for easy integration with other components and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact and space-saving design, making it suitable for applications with limited board space.

Minimum Supply Voltage: 2.5 V

The minimum supply voltage requirement of 2.5V allows for low power operation, conserving energy and making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the DSP can withstand and operate reliably in harsh environments.

No. of External Interrupts: 3

With 3 external interrupts, this DSP can handle multiple input events simultaneously, enabling efficient multitasking and interrupt-driven processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the DSP to function reliably even in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides a reliable and corrosion-resistant connection, ensuring long-term performance and reliability.

ADC Channels: YES

The presence of ADC channels allows the DSP to convert analog signals into digital data, expanding its capabilities and compatibility with various sensors and input devices.

Terminal Position: DUAL

The dual terminal position makes it easier for the DSP to interconnect with other components or devices, simplifying the overall circuit design and assembly process.

ROM Words: 4096

With 4096 ROM words, this DSP can store a large amount of program instructions, allowing for complex algorithms and extensive software functionality.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm ensures compatibility with compact and slim designs, making it suitable for space-constrained applications.

RAM Words: 512

The 512 RAM words provide ample memory for temporary data storage, ensuring efficient and reliable execution of algorithms and data processing tasks.

Width: 7.5 mm

The compact width of 7.5 mm allows for easy integration and space utilization, making it suitable for applications with tight size constraints.

Data EEPROM Size: 1K

The 1K data EEPROM size offers sufficient non-volatile memory for storing critical data or program parameters, ensuring data persistence and reliability.

Peripherals: BOD, POR, PWM(8), QEI, TIMER(3), WDT

The inclusion of various peripherals such as BOD, POR, PWM, QEI, TIMER, and WDT enhances the functionality and versatility of the DSP, making it suitable for a wide range of applications.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, this DSP can process data at high speeds, enabling real-time and time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 40

The 40 seconds maximum time allowed at the peak reflow temperature ensures proper soldering and reliable assembly during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and reliability of the DSP during manufacturing processes.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data transfer and parallel processing within the DSP, enhancing its overall performance and speed.

Length: 17.9 mm

The compact length of 17.9 mm enables easy integration and compatibility with various designs and applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP can operate reliably in harsh temperature conditions typically found in industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

With its digital signal processing capabilities and additional peripherals, this DSP excels in processing and analyzing digital signals in a variety of applications.

No. of Timers: 3

The presence of 3 timers allows for precise timing control and synchronization of various functions, making it suitable for time-critical applications.

RAM Bytes: 512

With 512 RAM bytes, this DSP provides sufficient memory for temporary data storage and efficient execution of complex algorithms.

Technology: CMOS

The CMOS technology used in this DSP ensures low power consumption, high noise immunity, and compatibility with a wide range of microelectronics applications.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and secure electrical connections, ensuring reliable performance and ease of assembly.

Analog to Digital Convertors: 6-Ch 10-Bit

The inclusion of 6-channel 10-bit analog-to-digital converters provides high-precision analog input conversion, expanding the DSP's capabilities in acquiring and processing analog signals.

Maximum Supply Current: 300 mA

With a maximum supply current rating of 300 mA, this DSP can deliver sufficient power to meet the demands of power-hungry applications.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage ensures compatibility with standard power sources, making it easier to integrate the DSP into various systems.

PWM Channels: YES

The presence of PWM channels allows for precise control and modulation of digital signals, making the DSP suitable for applications such as motor control and audio processing.

Connectivity: I2C, SPI, UART

With support for I2C, SPI, and UART connectivity, this DSP can easily communicate with other devices, expanding its compatibility and versatility.

ROM Programmability: FLASH

The ROM's flash programmability allows for easy and flexible firmware updates and customization, ensuring adaptability and future-proofing of the DSP.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch enables easy integration into standard PCB designs, simplifying the assembly process and ensuring compatibility with existing systems.

Format: FLOATING POINT

The floating-point format enables high-precision calculations and signal processing, making this DSP suitable for applications that require complex mathematical operations.

Moisture Sensitivity Level (MSL): 1

With an MSL rating of 1, this DSP has a low moisture sensitivity, ensuring reliable performance and longevity during storage and handling.

Speed: 30 rpm

The 30 rpm speed capability makes this DSP suitable for applications that require precise speed control, such as motor control and robotics.

Low Power Mode: YES

The low power mode feature allows the DSP to conserve energy during idle or low-demand periods, extending battery life and reducing power consumption.

Barrel Shifter: YES

The inclusion of a barrel shifter allows for efficient shifting and manipulation of binary data, enabling faster data processing and computational efficiency.

On Chip Program ROM Width: 24

The 24-bit on-chip program ROM width allows for the storage and execution of complex program code, enhancing the DSP's capabilities in handling sophisticated algorithms.

No. of I/O Lines: 20

With 20 I/O lines, this DSP offers ample connectivity options for external devices, enabling seamless integration and communication with peripherals and sensors.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F2010-30I/SOG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

512

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

30 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, PWM(8), QEI, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

DSPIC30F2010-30I/SOG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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