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XOMAP-L138

Texas Instruments

XOMAP-L138 by Texas Instruments

XOMAP-L138 by Texas Instruments is a DSP with 16-bit external data bus, 30 MHz clock frequency, and low power mode. Ideal for applications requiring high-speed signal processing in compact devices like smartphones and portable audio players.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,834 parts In-Stock

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8,834

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Digiode

USA . 2,828 parts In-Stock

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2,828

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Distributors (Availability)

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AZTECH Wire

Italy . 822 parts In-Stock

1+ parts

$12.274

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822

$12.274

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Parana Technologies

USA . 1,578 parts In-Stock

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$20.509

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$20.576

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1,578

$20.509

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$20.576

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DigiPath Technology Company

USA . 364 parts In-Stock

1+ parts

$22.583

100+ parts

$20.776

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364

$22.583

$20.776

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ChromeModa Solutions

Germany . 3,956 parts In-Stock

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$23.044

100+ parts

$18.896

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3,956

$23.044

$18.896

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IDEA Electronic Components Group

UK . 114 parts In-Stock

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$23.044

100+ parts

$21.892

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$20.740

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114

$23.044

$21.892

$20.740

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One Stop Electronics

USA . 953 parts In-Stock

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$26.000

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953

$26.000

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Corohmni

South Africa . 76 parts In-Stock

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$86.015

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76

$86.015

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Corphita

USA . 4,506 parts In-Stock

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Overview

Experience superior performance and efficiency with the XOMAP-L138 by Texas Instruments, a cutting-edge Digital Signal Processor that delivers unmatched quality and reliability. Designed with precision and expertise, this product offers endless possibilities in various applications, providing customers with unparalleled value and benefits. Transform your projects with the advanced features and advantages of the XOMAP-L138, setting a new standard in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Address Bus Width: 23

The wide address bus width allows for efficient handling and processing of memory addresses.

Package Shape: SQUARE

The square package shape makes it easier to integrate the product into various electronic devices.

No. of Terminals: 361

The large number of terminals provides flexibility for connecting the product to external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch allows for compact design and efficient routing of traces on circuit boards.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and increasing the product's efficiency.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount the product on the circuit board.

Maximum Seated Height: 1.4 mm

The low seated height helps in designing slim and compact electronic devices.

Width: 16 mm

The compact width allows for easy integration of the product in various electronic applications.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the product during manufacturing and maintenance.

External Data Bus Width: 16

The external data bus width of 16 enables fast and efficient data transfer between the processor and external devices.

Maximum Clock Frequency: 30 MHz

A high maximum clock frequency of 30 MHz allows for fast processing of signals and data.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances the product's processing efficiency and allows for parallel execution of tasks.

Length: 16 mm

The compact length of 16 mm makes it suitable for space-constrained electronic applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor provides advanced signal processing capabilities for various applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and mounting of the product onto the circuit board.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures stable and reliable operation of the product.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting of the product on the circuit board.

Format: FLOATING POINT

The floating-point format enables high-precision calculations and processing of signals.

Low Power Mode: YES

The low power mode helps in reducing power consumption during idle or low processing tasks, resulting in energy-efficient operation.

Technical Specifications

Digital Signal Processors (DSPs) XOMAP-L138 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

Low Power Mode:

YES

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

XOMAP-L138 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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