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XOMAP3515BCUS

Texas Instruments

XOMAP3515BCUS by Texas Instruments

XOMAP3515BCUS by Texas Instruments is a DSP with 16-bit external data bus width, 38.4 MHz clock frequency, and 423 terminals. It is used in commercial applications requiring low power consumption and floating-point format for signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,030 parts In-Stock

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Digiode

USA . 1,561 parts In-Stock

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Ampacity Inc.

Singapore . 470 parts In-Stock

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$15.000

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470

$15.000

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AZTECH Wire

Italy . 288 parts In-Stock

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$18.765

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288

$18.765

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One Stop Electronics

USA . 311 parts In-Stock

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$27.000

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Parana Technologies

USA . 1,636 parts In-Stock

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$30.846

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$69.436

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DigiPath Technology Company

USA . 2,252 parts In-Stock

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$33.965

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$31.248

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$33.965

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ChromeModa Solutions

Germany . 2,550 parts In-Stock

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$34.658

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$28.420

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$34.658

$28.420

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IDEA Electronic Components Group

UK . 1,736 parts In-Stock

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$34.658

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$32.925

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$31.192

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Corohmni

South Africa . 1,058 parts In-Stock

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$48.828

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Corphita

USA . 2,528 parts In-Stock

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Microchip USA

USA . 465 parts In-Stock

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Assy Fe

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Overview

Unlock the power of cutting-edge technology with the XOMAP3515BCUS by Texas Instruments. This digital signal processor boasts top-notch quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this DSP offers unmatched value and benefits to customers seeking high-performance solutions. Take your projects to the next level with the XOMAP3515BCUS and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, saving time and cost in production.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for versatile power options, enabling the DSP to be used in a variety of applications.

Address Bus Width: 26

A wide address bus width allows for quick and efficient data processing, making the DSP suitable for complex tasks.

Package Shape: SQUARE

The square shape of the package offers a compact and efficient design, saving space in electronic systems.

Power Supplies (V): 1.1,1.8,3.3

Multiple power supply options provide flexibility and compatibility with different electrical systems.

No. of Terminals: 423

Having a high number of terminals allows for plenty of connectivity options, making the DSP versatile and adaptable to various setups.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style enhances connectivity, reduces signal interference, and optimizes performance.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and extends the battery life of portable devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature indicates the DSP's ability to withstand harsh environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the DSP can function reliably even in cold conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy installation and maintenance of the DSP in electronic systems.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to a slim and compact design, suitable for space-constrained applications.

Width: 16 mm

The narrow width of the DSP makes it suitable for integration into small and compact electronic devices.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during production and operation.

External Data Bus Width: 16

A matching external data bus width ensures smooth and fast data transfer between the DSP and peripheral devices.

Maximum Clock Frequency: 38.4 MHz

The high maximum clock frequency enables the DSP to process data quickly, enhancing overall performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architectures enable parallel processing of tasks, increasing the DSP's efficiency and speed.

Length: 16 mm

The compact length of the DSP contributes to its overall small form factor and suitability for compact electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the DSP is suitable for standard operating conditions in commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Support for various peripheral devices and mixed-signal processing capabilities make the DSP versatile for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with modern electronic systems.

Terminal Form: BALL

Ball terminal form ensures secure and reliable connections, reducing the risk of signal loss or disconnections.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a stable and consistent power source for the DSP, ensuring reliable operation.

Terminal Pitch: 0.65 mm

A small terminal pitch enhances connectivity density, enabling more terminals in a compact space for increased functionality.

Format: FLOATING POINT

Support for floating-point format allows for precise and accurate calculations, making the DSP suitable for applications requiring high computational accuracy.

Low Power Mode: YES

The low power mode option helps conserve energy and extend battery life in portable devices, making the DSP more efficient and cost-effective.

Technical Specifications

Digital Signal Processors (DSPs) XOMAP3515BCUS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

26

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B423

Length:

16 mm

Low Power Mode:

YES

No. of Terminals:

423

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

XOMAP3515BCUS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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