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XOMAPL138ZWT

Texas Instruments

XOMAPL138ZWT by Texas Instruments

XOMAPL138ZWT by Texas Instruments is a DSP with 16mm width, 361 terminals, and 50MHz clock frequency. It is used in applications requiring low power consumption and high-speed data processing, such as digital signal processing tasks in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,720 parts In-Stock

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4,720

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Digiode

USA . 1,489 parts In-Stock

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1,489

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 544 parts In-Stock

1+ parts

$7.375

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544

$7.375

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One Stop Electronics

USA . 1,045 parts In-Stock

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$12.000

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1,045

$12.000

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Parana Technologies

USA . 914 parts In-Stock

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$56.252

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914

$56.252

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$57.455

100+ parts

$52.284

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$47.113

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5,000

$57.455

$52.284

$47.113

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Corohmni

South Africa . 2,947 parts In-Stock

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$61.659

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2,947

$61.659

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IDEA Electronic Components Group

UK . 1,011 parts In-Stock

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$63.204

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$60.044

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$56.884

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1,011

$63.204

$60.044

$56.884

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ChromeModa Solutions

Germany . 500 parts In-Stock

1+ parts

$63.204

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$51.827

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500

$63.204

$51.827

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Component Stockers USA

USA . 677 parts In-Stock

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$99.990

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677

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Microchip USA

USA . 4,338 parts In-Stock

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4,338

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Corphita

USA . 2,329 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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90

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DigiPath Technology Company

USA . 6 parts In-Stock

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$56.985

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6

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$56.985

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Overview

Experience the power of cutting-edge technology with the XOMAPL138ZWT by Texas Instruments. As a leading manufacturer in the industry of digital signal processors, Texas Instruments guarantees top-notch quality and reliability. This product offers a wide range of applications in various industries, providing unparalleled performance and efficiency. With its advanced features and innovative design, the XOMAPL138ZWT delivers exceptional value and benefits to customers seeking high-performance solutions. Upgrade your projects with this versatile DSP and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly process.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage tolerance provides flexibility in power supply design.

Address Bus Width: 24

Wide address bus width allows for efficient memory addressing and data processing.

Package Shape: SQUARE

Square shape allows for easier and more uniform PCB layout.

Power Supplies (V): 1.2,1.8/3.3

Multiple power supply options allow for versatile compatibility with different systems.

No. of Terminals: 361

Large number of terminals enable connectivity to various external components and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers high density integration and space-saving design.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures power efficiency and compatibility with low power applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on PCBs.

Maximum Seated Height: 1.4 mm

Low maximum seated height contributes to overall compact form factor of the product.

Width: 16 mm

Compact width provides flexibility in PCB layout and space-constrained designs.

Boundary Scan: YES

Boundary scan feature enables efficient testing and debugging during product development and production.

External Data Bus Width: 16

Wide external data bus allows for high-speed and efficient data transfer between the DSP and external components.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency enables fast signal processing and real-time operation.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture supports parallel processing and efficient data flow within the DSP.

Length: 16 mm

Compact length complements the overall small footprint of the product, suitable for space-constrained applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for integration of various functions and interfaces for enhanced functionality.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, suitable for battery-operated or noise-sensitive applications.

Terminal Form: BALL

Ball terminal form facilitates reliable and secure connections during PCB assembly and operation.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable performance of the DSP.

Terminal Pitch: 0.8 mm

Small terminal pitch allows for high-density mounting and compact PCB design.

Format: FLOATING POINT

Floating-point format enhances accuracy and precision in numerical computations and signal processing tasks.

Low Power Mode: YES

Low power mode feature enables energy-efficient operation and prolongs battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) XOMAPL138ZWT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

Low Power Mode:

YES

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

XOMAPL138ZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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