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XOMAP3503DCBB

Texas Instruments

XOMAP3503DCBB by Texas Instruments

XOMAP3503DCBB by Texas Instruments is a DSP with 16-bit external data bus, 38.4 MHz clock frequency, and 26-bit address bus width. Ideal for commercial applications requiring low power consumption and floating-point format processing in a compact grid array package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,948 parts In-Stock

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4,948

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Digiode

USA . 424 parts In-Stock

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424

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Distributors (Availability)

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One Stop Electronics

USA . 1,613 parts In-Stock

1+ parts

$3.000

100+ parts

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1,613

$3.000

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AZTECH Wire

Italy . 301 parts In-Stock

1+ parts

$14.872

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301

$14.872

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Corohmni

South Africa . 709 parts In-Stock

1+ parts

$25.469

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709

$25.469

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Parana Technologies

USA . 795 parts In-Stock

1+ parts

$61.156

100+ parts

$5,679.295

1k+ parts

$55.041

10k+ parts

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795

$61.156

$5,679.295

$55.041

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DigiPath Technology Company

USA . 1,236 parts In-Stock

1+ parts

$67.341

100+ parts

$61.953

1k+ parts

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1,236

$67.341

$61.953

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ChromeModa Solutions

Germany . 3,900 parts In-Stock

1+ parts

$68.715

100+ parts

$56.346

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3,900

$68.715

$56.346

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IDEA Electronic Components Group

UK . 1,579 parts In-Stock

1+ parts

$68.715

100+ parts

$65.279

1k+ parts

$61.844

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1,579

$68.715

$65.279

$61.844

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Corphita

USA . 1,091 parts In-Stock

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1,091

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Overview

Unlock the power of cutting-edge technology with the XOMAP3503DCBB from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that offer unparalleled performance and reliability. Ideal for a variety of applications, this DSP provides customers with value and benefits that far exceed expectations. Experience seamless operation and exceptional efficiency with the XOMAP3503DCBB - the perfect choice for those looking to elevate their projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material helps in reducing the overall weight of the product and provides durability for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage ensures stable and reliable operation of the product under varying voltage conditions.

Address Bus Width: 26

A wide address bus width of 26 improves the processing speed and efficiency of the DSP for handling complex algorithms and data.

Package Shape: SQUARE

The square package shape optimizes space utilization and facilitates efficient PCB layout and assembly.

No. of Terminals: 515

The high number of terminals allows for seamless connectivity and integration with external components, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables high-density mounting, reducing overall footprint and enhancing performance.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and helps in minimizing power consumption during operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70°C ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance of 0°C ensures the product can operate effectively in various temperature ranges.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9 mm allows for compact and slim designs, ideal for space-constrained applications.

Width: 12 mm

The moderate width of 12 mm strikes a balance between compactness and functionality, making the product suitable for various applications.

Boundary Scan: YES

The presence of boundary scan technology enables efficient testing and debugging of the product during development and production.

External Data Bus Width: 16

The 16-bit external data bus width enhances data transfer speed and efficiency, improving the overall performance of the DSP.

Maximum Clock Frequency: 38.4 MHz

The high maximum clock frequency of 38.4 MHz enables fast data processing and execution of instructions, enhancing the real-time performance of the product.

Internal Bus Architecture: MULTIPLE

The use of multiple internal bus architecture enhances data flow and communication within the DSP, improving overall efficiency and performance.

Length: 12 mm

The moderate length of 12 mm contributes to a well-balanced form factor and design, suitable for a range of applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for standard commercial operating conditions, making the product versatile for various industries.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Having a combination of digital signal processor and mixed-signal capabilities broadens the range of applications and tasks the product can handle.

Technology: CMOS

The CMOS technology provides low power consumption, high speed, and compatibility with various systems, making the product efficient and versatile.

Terminal Form: BALL

The ball terminal form facilitates reliable connections and soldering, ensuring stable performance and durability of the product.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and compact design, contributing to overall product efficiency and performance.

Format: FLOATING POINT

Supporting floating-point format enables accurate and efficient processing of decimal numbers and complex algorithms, enhancing the computational capabilities of the DSP.

Low Power Mode: YES

The presence of a low power mode allows for energy-efficient operation and extended battery life, making the product suitable for portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) XOMAP3503DCBB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

26

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B515

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

515

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XOMAP3503DCBB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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