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XOMAP3515BCBB

Texas Instruments

XOMAP3515BCBB by Texas Instruments

XOMAP3515BCBB by Texas Instruments is a DSP with 16-bit external data bus, 38.4 MHz clock frequency, and 26-bit address bus width. Ideal for commercial applications requiring low power consumption and floating-point format processing.

Median Price

$63.305

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

$49.800

100+ parts

$48.800

1k+ parts

$47.810

10k+ parts

-

19

$49.800

$48.800

$47.810

-

DigiKey

USA . 121 parts In-Stock

1+ parts

$76.810

100+ parts

$60.612

1k+ parts

-

10k+ parts

-

121

$76.810

$60.612

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,178 parts In-Stock

1+ parts

$58.776

100+ parts

-

1k+ parts

-

10k+ parts

-

1,178

$58.776

-

-

-

Vyrian

USA . 8,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,839

-

-

-

-

Semi Source

USA . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19

-

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-

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Holdelec - ElecDif-Pro

France . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,009 parts In-Stock

1+ parts

$55.683

100+ parts

-

1k+ parts

-

10k+ parts

-

2,009

$55.683

-

-

-

Component Stockers USA

USA . 85 parts In-Stock

1+ parts

$61.430

100+ parts

$49.690

1k+ parts

-

10k+ parts

-

85

$61.430

$49.690

-

-

Parana Technologies

USA . 1,142 parts In-Stock

1+ parts

$67.013

100+ parts

-

1k+ parts

-

10k+ parts

-

1,142

$67.013

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-

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Corohmni

South Africa . 400 parts In-Stock

1+ parts

$67.305

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$67.305

-

-

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DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$73.790

100+ parts

-

1k+ parts

-

10k+ parts

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2,332

$73.790

-

-

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ChromeModa Solutions

Germany . 4,898 parts In-Stock

1+ parts

$75.296

100+ parts

$61.743

1k+ parts

-

10k+ parts

-

4,898

$75.296

$61.743

-

-

IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$75.296

100+ parts

$71.531

1k+ parts

$67.766

10k+ parts

-

431

$75.296

$71.531

$67.766

-

Microchip USA

USA . 336 parts In-Stock

1+ parts

$144.490

100+ parts

$141.970

1k+ parts

$140.720

10k+ parts

$139.460

336

$144.490

$141.970

$140.720

$139.460

Overview

Experience unparalleled performance and reliability with the XOMAP3515BCBB by Texas Instruments, a leading manufacturer in the industry. This digital signal processor is designed for a wide range of applications, offering customers exceptional value and benefits. With its advanced technology and low power mode, this product delivers superior efficiency and functionality. Trust Texas Instruments to provide you with cutting-edge solutions for all your DSP needs. Elevate your projects with the XOMAP3515BCBB today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring long-term performance and reliability.

Surface Mount: YES

Easy to install and replace, making it convenient for manufacturers and technicians.

Maximum Supply Voltage: 1.89 V

Optimal voltage range for efficient and safe operation of the DSP.

Address Bus Width: 26

Allows for efficient data processing and communication within the DSP.

Package Shape: SQUARE

Space-saving design that fits well in compact electronic devices.

Minimum Supply Voltage: 1.71 V

Ensures stable performance even under low voltage conditions.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, ideal for a variety of operating environments.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures without compromising performance.

No. of Terminals: 515

Offers multiple connection points for external devices, expanding the functionality of the DSP.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enhances heat dissipation and facilitates compact layout designs in electronic devices.

Power Supplies (V): 1.1, 1.8, 3.3

Supports a wide range of power supply options, making it compatible with different electronic systems.

Terminal Position: BOTTOM

Convenient terminal position for easy integration into circuit boards.

Maximum Seated Height: 1 mm

Low profile design for slim electronic devices.

Width: 14 mm

Compact size for space-constrained applications.

Boundary Scan: YES

Enables efficient testing and debugging of the DSP during the manufacturing process.

External Data Bus Width: 16

Efficient data transfer capability for faster processing speed.

Maximum Clock Frequency: 38.4 MHz

High clock frequency for rapid data processing and real-time applications.

Internal Bus Architecture: MULTIPLE

Efficient data flow within the DSP for improved performance and multitasking capabilities.

Length: 14 mm

Compact size for space-constrained applications.

Temperature Grade: COMMERCIAL

Suitable for commercial electronic devices that operate in standard temperature ranges.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Versatile functionality for a wide range of digital signal processing applications.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal design for secure and reliable connections.

Nominal Supply Voltage: 1.8 V

Stable voltage supply for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density integration in electronic systems.

Format: FLOATING POINT

Supports floating-point calculations for precision in signal processing tasks.

Low Power Mode: YES

Energy-efficient mode for extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) XOMAP3515BCBB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

26

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B515

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

515

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XOMAP3515BCBB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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