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ADSP-TS101SAB1Z000

Analog Devices

ADSP-TS101SAB1Z000 by Analog Devices

ADSP-TS101SAB1Z000 by Analog Devices is a 32-bit DSP with a max supply voltage of 1.26V and operating temperature range of -40 to 85°C. It is used as a digital signal processor in industrial applications.

Median Price

$408.695

Lifecycle Status

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Arrow

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Analog Devices Inc

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DigiKey

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Digiode

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AZTECH Wire

Italy . 567 parts In-Stock

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Parana Technologies

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IDEA Electronic Components Group

UK . 90 parts In-Stock

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Aztec Data Supply Inc.

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DigiPath Technology Company

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Semicontronic

India . 2 parts In-Stock

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Corohmni

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Corphita

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Ampacity Inc.

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Continental Prestige Electronics

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Overview

Discover a world of possibilities with the ADSP-TS101SAB1Z000 by Analog Devices. Known for their exceptional quality and superior manufacturing, Analog Devices has once again delivered a game-changing product. As a leading digital signal processor in its category, the ADSP-TS101SAB1Z000 offers unparalleled performance and versatility. Whether you're working on audio processing, wireless communication, or multimedia applications, this DSP delivers optimal results. With its low power mode and barrel shifter feature, you can expect maximum efficiency and precision. Embrace the power of Analog Devices and unlock the potential of your projects with the ADSP-TS101SAB1Z000.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and ensures protection of the internal components of the DSP.

Surface Mount: YES

The surface mount feature makes it easy to integrate the DSP into circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 1.26 V

Having a maximum supply voltage of 1.26 V allows for efficient power management and helps prevent overheating or damage to the device.

Address Bus Width: 32

A wider address bus width of 32 enables the DSP to access and process larger amounts of data quickly and efficiently.

Package Shape: SQUARE

The square package shape simplifies the layout on circuit boards, making it easier to accommodate the DSP in various designs.

No. of Terminals: 625

With a high number of terminals, the DSP can support a wide range of connections and interfaces, increasing its versatility.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14 V helps in reducing power consumption and prolonging the battery life of devices using the DSP.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C ensures the DSP can perform reliably even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the DSP to function effectively in extreme cold conditions without any issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier and more secure soldering during the assembly process.

Maximum Seated Height: 2.5 mm

The maximum seated height of 2.5 mm allows for a compact and space-saving design when integrating the DSP into electronic devices.

Width: 27 mm

The width of 27 mm makes the DSP suitable for applications where space is limited and compact size is crucial.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the DSP during production, reducing time and costs for quality control.

External Data Bus Width: 64

A wider external data bus width of 64 allows for faster data transfer and processing, improving overall performance of the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures the soldering of the DSP terminals is secure and reliable even under extreme conditions.

Internal Bus Architecture: SINGLE

The single internal bus architecture simplifies the design and operation of the DSP, enhancing its efficiency and ease of use.

Length: 27 mm

With a length of 27 mm, the DSP can be easily integrated into various electronic devices without taking up too much space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific peripheral IC type of digital signal processor provides specialized processing capabilities for digital signals, making it suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in the DSP offers low power consumption, high speed, and compatibility with various interfaces, making it a versatile choice for digital signal processing.

Terminal Form: BALL

The terminal form of ball provides secure connections and facilitates efficient soldering during the assembly process, ensuring reliability in operation.

Nominal Supply Voltage: 1.25 V

With a nominal supply voltage of 1.25 V, the DSP operates efficiently and reliably within the specified voltage range, ensuring optimal performance.

Terminal Pitch: 1 mm

The compact terminal pitch of 1 mm allows for high-density packaging of the DSP, saving space on circuit boards and enabling complex designs.

Format: FLOATING POINT

The floating point format enables the DSP to perform complex mathematical calculations with high precision and accuracy, making it suitable for signal processing applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the DSP can withstand moderate exposure to moisture during handling and assembly processes without compromising its reliability.

Low Power Mode: YES

The low power mode feature allows the DSP to optimize power consumption based on the processing workload, enabling energy-efficient operation and prolonging battery life.

Barrel Shifter: YES

The inclusion of a barrel shifter in the DSP enhances its computational capabilities by enabling fast and efficient shift operations, improving overall performance.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-TS101SAB1Z000 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

32

Barrel Shifter:

YES

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

ADSP-TS101SAB1Z000 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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