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DSPIC33FJ128GP804-I/ML

Microchip Technology

DSPIC33FJ128GP804-I/ML by Microchip Technology

DSPIC33FJ128GP804-I/ML by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C. Ideal for industrial applications requiring high-speed signal processing in a compact package. Features include flash ROM programmability, CMOS technology, and low supply current of 75mA at 3.3V.

Median Price

$6.889

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Microchip Technology

USA . 53 parts In-Stock

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$7.540

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$6.250

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$5.750

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$5.480

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Verical

USA . 90 parts In-Stock

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Arrow

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$6.349

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Chip Stock

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Vyrian

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IBS Electronics

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Nova Conductors

Japan . 100 parts In-Stock

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Andel Nordic

Denmark . 4,720 parts In-Stock

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$2.073

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$1.990

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$1.990

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Ampacity Inc.

Singapore . 696 parts In-Stock

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$5.180

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Semicontronic

India . 539 parts In-Stock

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$5.180

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$5.050

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$5.025

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Aztec Data Supply Inc.

USA . 201 parts In-Stock

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$35.650

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Corohmni

South Africa . 56 parts In-Stock

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Advanced Electronics

New Zealand . 49 parts In-Stock

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Lixinc

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iodParts Technologies Inc.

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West Coast Incorporated

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Overview

Revolutionize your digital signal processing with the DSPIC33FJ128GP804-I/ML by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology sets the standard for quality and reliability. This powerful 16-bit digital signal processor offers unparalleled performance and efficiency, making it perfect for a wide range of applications. Whether you're designing advanced control systems or high-speed communication devices, this DSP delivers the value, benefits, and advantages you need to stay ahead of the competition. Trust Microchip Technology to provide the cutting-edge technology you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the DSP, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy integration of the DSP into electronic circuits, making it ideal for compact and space-saving designs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the DSP can handle high power requirements while ensuring stable and efficient performance.

Package Shape: SQUARE

The square package shape provides uniformity and ease of placement in circuit designs, promoting efficient PCB layout and assembly.

Bit Size: 16

A 16-bit size allows for high processing capabilities and precision in handling digital signals, making the DSP suitable for complex signal processing tasks.

Power Supplies (V): 3.3

Operating at a stable power supply of 3.3 V ensures consistent performance and energy efficiency, making the DSP an ideal choice for power-sensitive applications.

No. of Terminals: 44

With 44 terminals, the DSP offers ample connectivity options for interfacing with other electronic components, enabling versatile and customizable system configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of a chip carrier package style with a heat sink/slug design and very thin profile enhances thermal dissipation and space utilization, making the DSP suitable for high-performance applications in constrained environments.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with a wide range of power sources, offering flexibility in system integration and operation.

Maximum Operating Temperature: 85 °C

Operating reliably at temperatures up to 85°C, the DSP can withstand harsh environmental conditions, making it suitable for industrial applications with demanding operating environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the DSP can function in extreme cold conditions, providing versatility for applications in diverse climates.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and solderability, ensuring secure connections and signal integrity in diverse operating environments.

Terminal Position: QUAD

The quad terminal position allows for easy routing and connection of the DSP in circuit designs, optimizing signal transmission and system performance.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, the DSP can be mounted close to other components on the PCB, reducing signal interference and improving overall system efficiency.

Width: 8 mm

The 8 mm width of the DSP provides a compact form factor, enabling space-efficient integration in electronic devices and systems with limited physical dimensions.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40 MHz, the DSP can process signals rapidly and efficiently, making it suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 40

The DSP can withstand peak reflow temperatures for up to 40 seconds, ensuring reliable soldering and assembly processes, leading to robust and durable end products.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering of the DSP onto the PCB, ensuring secure connections and long-term reliability in operation.

Length: 8 mm

With a length of 8 mm, the DSP offers a uniform and standardized form factor for easy integration and compatibility with existing electronic components and systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the DSP can operate reliably in harsh environmental conditions, providing robust performance and longevity in demanding settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

As a digital signal processor and controller, the DSP offers versatile processing capabilities and control functions for a wide range of applications, making it a versatile choice for complex signal processing tasks.

Technology: CMOS

Utilizing CMOS technology, the DSP delivers low power consumption and high-speed performance, making it suitable for energy-efficient and high-performance applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances solder joint reliability and signal integrity, ensuring stable connections and optimal performance in demanding operating conditions.

Maximum Supply Current: 75 mA

With a maximum supply current of 75 mA, the DSP offers efficient power consumption and operational stability, making it suitable for battery-powered and low-power applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, the DSP maintains consistent performance and energy efficiency, ensuring reliable operation in a variety of system configurations.

ROM Programmability: FLASH

Featuring flash ROM programmability, the DSP allows for versatile and customizable firmware updates, enabling adaptation to changing system requirements and functionalities.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, the DSP offers precise and compact terminal spacing, enabling high-density PCB layouts and optimized signal routing for enhanced system performance.

Format: FLOATING POINT

Operating in a floating-point format, the DSP provides high precision and accuracy in numerical computations, making it ideal for applications requiring complex mathematical calculations and signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ128GP804-I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC33FJ128GP804-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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