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MC56F8346VFVE

NXP Semiconductors

MC56F8346VFVE by NXP Semiconductors

MC56F8346VFVE by NXP Semiconductors is a 16-bit DSP with 120 MHz clock frequency, 131072 ROM words, and 12288 RAM bytes. Ideal for industrial applications requiring low power mode, it features a barrel shifter and operates at temperatures ranging from -40 to 105°C.

Median Price

$26.806

Lifecycle Status

EOL

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 35 parts In-Stock

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$24.650

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$23.170

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$20.950

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35

$24.650

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$20.950

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Verical

USA . 35 parts In-Stock

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$28.962

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$26.188

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Flip Electronics (Authorized)

USA . 19 parts In-Stock

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Digiode

USA . 2,197 parts In-Stock

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$23.418

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Nova Conductors

Japan . 500 parts In-Stock

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$31.020

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Vyrian

USA . 7,826 parts In-Stock

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Anansix

USA . 2,390 parts In-Stock

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Chip Stock

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Flip Electronics

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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AZTECH Wire

Italy . 708 parts In-Stock

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$16.367

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Ampacity Inc.

Singapore . 30 parts In-Stock

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$20.950

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Corphita

USA . 3,857 parts In-Stock

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$22.185

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Corohmni

South Africa . 276 parts In-Stock

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$31.019

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Continental Prestige Electronics

USA . 1,276 parts In-Stock

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$31.020

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$30.399

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$30.399

Bastille Electronics

Australia . 10 parts In-Stock

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$31.020

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$29.469

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$27.608

10

$31.020

$29.469

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$27.608

Vigor

Singapore . 8,686 parts In-Stock

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$35.070

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Semicontronic

India . 30 parts In-Stock

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$45.600

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$44.460

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$44.232

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Aztec Data Supply Inc.

USA . 4,959 parts In-Stock

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$71.705

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Microchip USA

USA . 1,468 parts In-Stock

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UNI Independent Distributors

Spain . 3,929 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Authorized Procurement Solutions

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ChipstoGo Electronic ltd

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iodParts Technologies Inc.

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Overview

Unlock the power of advanced digital signal processing with the MC56F8346VFVE by NXP Semiconductors. Crafted with precision and expertise, this DSP offers unparalleled performance in a variety of applications. From industrial automation to consumer electronics, this product delivers reliable results while optimizing efficiency and enhancing user experience. Embrace innovation and elevate your projects with the quality and value that only NXP Semiconductors can provide. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

With surface mount capability, this DSP can easily be integrated into compact electronic circuits, saving space on PCBs.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V allows for efficient power consumption, making the DSP suitable for low-power applications.

Address Bus Width: 17

A wider address bus width of 17 enhances the DSP's ability to handle complex data processing tasks efficiently.

Package Shape: SQUARE

The square package shape provides a uniform form factor, facilitating easy integration into electronic systems.

Bit Size: 16

A bit size of 16 allows for high-speed processing of digital signals, making this DSP ideal for applications requiring real-time data handling.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options at 2.5 V and 3.3 V offers flexibility in designing circuits for different voltage requirements.

No. of Terminals: 144

With 144 terminals, this DSP enables connectivity with a wide range of external components, enhancing its versatility in system design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package styles provide versatility in mounting options, making it suitable for various PCB layouts.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage of 2.25 V ensures that the DSP can operate reliably even under low-power conditions, extending its range of applications.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8346VFVE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

17

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MC56F8346VFVE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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