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TMX320C30PPM50

Texas Instruments

TMX320C30PPM50 by Texas Instruments

TMX320C30PPM50 by Texas Instruments is a 32-bit DSP with 2048 RAM words, operating at temperatures from 0 to 85°C. With a supply voltage of 5V and current of 600mA, it's ideal for digital signal processing applications requiring high performance in a square-shaped flatpack package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,629 parts In-Stock

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Digiode

USA . 1,887 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Semicontronic

India . 994 parts In-Stock

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$1.000

100+ parts

$0.975

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$0.970

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994

$1.000

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AZTECH Wire

Italy . 449 parts In-Stock

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$6.929

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One Stop Electronics

USA . 991 parts In-Stock

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$7.000

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$7.000

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Corohmni

South Africa . 241 parts In-Stock

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$21.260

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Ampacity Inc.

Singapore . 1,588 parts In-Stock

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$27.000

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Parana Technologies

USA . 1,443 parts In-Stock

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DigiPath Technology Company

USA . 1,781 parts In-Stock

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$78.496

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$72.216

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ChromeModa Solutions

Germany . 3,304 parts In-Stock

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$80.098

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$65.680

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IDEA Electronic Components Group

UK . 808 parts In-Stock

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$80.098

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$76.093

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$72.088

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808

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Corphita

USA . 4,265 parts In-Stock

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Continental Prestige Electronics

USA . 3,678 parts In-Stock

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Argo Parts USA

USA . 1,811 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMX320C30PPM50 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This versatile product is perfect for a range of applications, offering unmatched performance and efficiency. Experience seamless functionality and superior processing capabilities, all while enjoying the value and benefits that come with choosing Texas Instruments. Upgrade your projects with the TMX320C30PPM50 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the DSP, making it suitable for various environments.

Surface Mount: YES

Facilitates easy installation and integration onto circuit boards.

Bit Size: 32

Offers high computational capabilities for processing complex digital signals efficiently.

Power Supplies (V): 5

Operates efficiently at a standard voltage, ensuring compatibility with common power sources.

No. of Terminals: 208

Provides ample connectivity options for interfacing with other components in a system.

Package Style (Meter): FLATPACK

Facilitates space-efficient packaging and placement within electronic devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature conditions.

Minimum Operating Temperature: 0 °C

Offers a wide operating temperature range for versatility in various environments.

Terminal Position: QUAD

Allows for easy organization and connection of terminals for efficient signal processing.

RAM Words: 2048

Provides sufficient memory capacity for storing and manipulating data during signal processing tasks.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed in data processing.

Terminal Form: GULL WING

Facilitates reliable soldering and connection of terminals for stable operation.

Maximum Supply Current: 600 mA

Can handle high current loads for demanding signal processing tasks.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level for compatibility with various electronic systems.

Terminal Pitch: 0.5 mm

Provides a compact terminal layout for efficient PCB design and integration.

Format: FLOATING POINT

Supports floating-point arithmetic for high precision in numerical calculations.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C30PPM50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FLOATING POINT

JESD-30 Code:

S-PQFP-G208

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2048

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TMX320C30PPM50 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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